Proceedings Electronic Components and Technology, 2005. ECTC '05.
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296

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17

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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Whisker formation on matte Sn influencing of high humidity

Proceedings Electronic Components and Technology, 2005. ECTC '05. ◽

10.1109/ectc.2005.1441300 ◽

2005 ◽

Author(s):

P. Oberndorff ◽

M. Dittes ◽

P. Crema ◽

S. Chopin

Keyword(s):

High Humidity ◽

Whisker Formation

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Thermal performance limits of polymer composite pin fin heat sinks

Proceedings Electronic Components and Technology, 2005. ECTC '05. ◽

10.1109/ectc.2005.1442025 ◽

2005 ◽

Author(s):

Raj Bahadur ◽

Avram Bar-Cohen

Keyword(s):

Polymer Composite ◽

Thermal Performance ◽

Performance Limits ◽

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High performance electrically conductive adhesives (ECAs) modified with novel aldehydes

Proceedings Electronic Components and Technology, 2005. ECTC '05. ◽

10.1109/ectc.2005.1442012 ◽

2005 ◽

Author(s):

Yi Li ◽

A. Whitman ◽

Kyoung-sik Moon ◽

C.P. Wong

Keyword(s):

High Performance ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Disposable Polydimethylsioxane Package for 'Bio~Microfluidic System'

Proceedings Electronic Components and Technology, 2005. ECTC '05. ◽

10.1109/ectc.2005.1441333 ◽

2005 ◽

Author(s):

Ser Choong Chong ◽

Ling Xie ◽

L. Yobas ◽

Hong Miao Ji ◽

Jing Li ◽

...

Keyword(s):

Microfluidic System

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Electrical characterization and modeling technique for substrate designs

Proceedings Electronic Components and Technology, 2005. ECTC '05. ◽

10.1109/ectc.2005.1441354 ◽

2005 ◽

Author(s):

N. Pham ◽

J. Audet ◽

M. Cases ◽

D.N. de Araujo ◽

E. Matoglu

Keyword(s):

Electrical Characterization ◽

Modeling Technique

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Modeling of Power Supply Noise with Non-Linear Drivers using Recurrent Neural Network (RNN) Models

Proceedings Electronic Components and Technology, 2005. ECTC '05. ◽

10.1109/ectc.2005.1441352 ◽

2005 ◽

Author(s):

B. Mutnury ◽

M. Swaminathan ◽

M. Cases ◽

Nam Pham ◽

D.N. de Araujo ◽

...

Keyword(s):

Neural Network ◽

Recurrent Neural Network ◽

Power Supply ◽

Power Supply Noise ◽

Supply Noise ◽

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A study of electromigration in Sn3.5Ag and Sn3.8Ag0.7Cu solder lines

Proceedings Electronic Components and Technology, 2005. ECTC '05. ◽

10.1109/ectc.2005.1441976 ◽

2005 ◽

Author(s):

Shengquan Ou ◽

K.N. Tu

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Stencil Printing Technology for Wafer Level Bumping at sub-100-Micron Pitch Using Pb-Free Alloys

Proceedings Electronic Components and Technology, 2005. ECTC '05. ◽

10.1109/ectc.2005.1441371 ◽

2005 ◽

Author(s):

R.W. Kay ◽

E. de Gourcuff ◽

M.P.Y. Desmulliez ◽

G.J. Jackson ◽

H.A.H. Steen ◽

...

Keyword(s):

Wafer Level ◽

Printing Technology ◽

Stencil Printing

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Smart Three Axis Compliant (STAC) Interconnect: An Ultra-High Density MEMS Based Interconnect for Wafer-Level Ultra-Thin Die

Proceedings Electronic Components and Technology, 2005. ECTC '05. ◽

10.1109/ectc.2005.1441407 ◽

2005 ◽

Author(s):

P. Arunasalam ◽

H.D. Ackler ◽

B.G. Sammakia

Keyword(s):

High Density ◽

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Effect of interface on thermal conductivity of polymer composite

Proceedings Electronic Components and Technology, 2005. ECTC '05. ◽

10.1109/ectc.2005.1441977 ◽

2005 ◽

Author(s):

Hai Dong ◽

Lianhua Fan ◽

C.P. Wong

Keyword(s):

Thermal Conductivity ◽

Polymer Composite

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