Phase change material (PCM) is useful for the storage and release of latent heat. However, its ability to conduct has hindered its engineering application. This study prepares a novel microencapsulated phase change material (MEPCM) by suspension polymerization. To improve the adhesion between the shell and the inorganic additive, triethoxyvinylsilane was incorporated copolymerizing with methyl methacrylate. Thermally conductive nanographite particle was added. This MEPCM was then incorporated into high-density polyethylene (HDPE) to form a series of thermally conductive PCM microcapsules that approached sphere shapes with diameters less than 2 [Formula: see text]m. Thermal analysis showed that the thermal stability and heat resistance of the microcapsule were improved. The thermal conductivity of HDPE was increased by 39% to 0.6358 W/m[Formula: see text]K, and the surface resistivity was lowered to [Formula: see text]/sq after the addition of MEPCM. The temperature on the top of the composite tested was lower than pristine HDPE. This was close to the onset melting temperature of the MEPCM (38.5[Formula: see text]C), [Formula: see text] lower than pure HDPE. The reduction is a significant improvement in temperature regulation. This enables MEPCMs to store and release heat much more effectively, and can thus be applied to medical construction materials to meet the temperature requirements of COVID-19 patients.
Thermally conductive high‐density polyethylene as novel phase‐change material: Application‐relevant long‐term stability