Experimental investigation of redeposition during focused ion beam milling of high speed steel

2012 ◽  
Vol 36 (3) ◽  
pp. 408-413 ◽  
Author(s):  
Sanket N. Bhavsar ◽  
Sivanandam Aravindan ◽  
P. Venkateswara Rao
2016 ◽  
Vol 1136 ◽  
pp. 277-281
Author(s):  
Zhen Yu Zhang ◽  
Bo Ya Yuan ◽  
Si Ling Huang ◽  
Zhi Feng Shi

A diamond tip with included angle of 90° and fillet radius of 45 nm is developed combining precision grinding and focused ion beam. Relatively high speed scratching at 8.4 m/s induced by the developed diamond tip is conducted on silicon (Si) (111) plane using an ultraprecision grinder. Width at the onset of chip formation on a Si wafer is 193 nm. Width and depth at the onset of crack formation are 1125 and 94 nm, respectively. Calculated normal forces at the onset of chip and crack formations are 424 μN and 14 mN, respectively, corresponding to the depth of cut is 44 and 466 nm.


2021 ◽  
pp. 107743
Author(s):  
Sebastian Tacke ◽  
Philipp Erdmann ◽  
Zhexin Wang ◽  
Sven Klumpe ◽  
Michael Grange ◽  
...  

2012 ◽  
Vol 132 (1) ◽  
pp. 99-106
Author(s):  
Ying Dai ◽  
Lei Yang ◽  
Longhai Wang ◽  
Bin Tian ◽  
Lianying Zou ◽  
...  

2008 ◽  
Vol 18 (9) ◽  
pp. 095010 ◽  
Author(s):  
Jing Fu ◽  
Sanjay B Joshi ◽  
Jeffrey M Catchmark

2003 ◽  
Vol 82 (8) ◽  
pp. 1281-1283 ◽  
Author(s):  
N. W. Liu ◽  
A. Datta ◽  
C. Y. Liu ◽  
Y. L. Wang

2013 ◽  
Vol 13 (8) ◽  
pp. 5542-5546 ◽  
Author(s):  
Ying Dai ◽  
Lei Yang ◽  
Longhai Wang ◽  
Lianying Zou ◽  
Bin Tian ◽  
...  

2009 ◽  
Vol 233 (1) ◽  
pp. 102-113 ◽  
Author(s):  
D. COOPER ◽  
R. TRUCHE ◽  
A.C. TWITCHETT-HARRISON ◽  
R.E. DUNIN-BORKOWSKI ◽  
P.A. MIDGLEY

2008 ◽  
Vol 85 (3) ◽  
pp. 640-645 ◽  
Author(s):  
Tao Dai ◽  
Xiangning Kang ◽  
Bei Zhang ◽  
Jun Xu ◽  
Kui Bao ◽  
...  

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