The effect of a preliminary acid leaching for the recovery of gold by thiourea from printed circuit boards (PCBs) of spent mobile phones, was investigated. Preliminary leaching is aimed to recover copper in the leachate that would compete with gold in the successive leaching of the residue with thiourea, thus preventing the formation of the gold-thiourea complex. Two hydrometallurgical routes were tested for the recovery of copper first, and gold after. The first one was based on a two-step leaching that utilizes sulfuric acid and hydrogen peroxide in the preliminary leaching and then thiourea for the recovery of gold in the successive leaching: A copper and gold recovery of 81% and 79% were obtained, respectively. In the second route, nitric acid was used: 100% of copper was recovered in the leachate and 85% of gold in the thiourea successive leaching. The main operative parameters, namely thiourea and ferric sulphate concentrations, leach time, liquid-solid ratio, and temperature were studied according to a factorial plan strategy. A flowsheet of the processes was proposed, and a mass balance of both routes was obtained. Finally, qualitative considerations on the technical and economic feasibility of the different routes were made.
Effect of Acid Leaching Pre-Treatment on Gold Extraction from Printed Circuit Boards of Spent Mobile Phones
