A new class of Wiener process models for degradation analysis

2015 ◽  
Vol 139 ◽  
pp. 58-67 ◽  
Author(s):  
Zhi-Sheng Ye ◽  
Nan Chen ◽  
Yan Shen
2018 ◽  
Vol 53 (15) ◽  
pp. 2053-2064 ◽  
Author(s):  
Tassos Mesogitis ◽  
James Kratz ◽  
Alex A Skordos

Thermochemical properties are needed to develop process models and define suitable cure cycles to convert thermosetting polymers into rigid glassy materials. Uncertainty surrounding the suitability of thermal analysis techniques and semi-empirical models developed for conventional composite materials has been raised for the new class of particle interleaf materials. This paper describes kinetics, conductivity, heat capacity and glass transition temperature measurements of HexPly® M21 particle interleaf material. Thermal models describing conventional, non-particle epoxy systems were fit to the data and validated through a thick-section cure. Results from curing experiments agree with heat transfer simulation predictions, indicating that established thermal analysis techniques and models can describe polymerisation and evolving material properties during processing of a material representing the class of interleaf toughened systems. A sensitivity study showed time savings up to about 20%, and associated energy-efficiency-productivity benefits can be achieved by using cure simulation for particle interleaf materials.


2021 ◽  
Vol 198 ◽  
pp. 109295
Author(s):  
Xi Liu ◽  
Rongqiao Wang ◽  
Dianyin Hu ◽  
Long Zhang ◽  
Gaoxiang Chen

2014 ◽  
Vol 130 ◽  
pp. 175-189 ◽  
Author(s):  
Weiwen Peng ◽  
Yan-Feng Li ◽  
Yuan-Jian Yang ◽  
Hong-Zhong Huang ◽  
Ming J. Zuo

2016 ◽  
Vol 65 ◽  
pp. 8-15 ◽  
Author(s):  
Junxing Li ◽  
Zhihua Wang ◽  
Xia Liu ◽  
Yongbo Zhang ◽  
Huimin Fu ◽  
...  

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