Grain boundary depletion and migration during selective oxidation of Cr in a Ni–5Cr binary alloy exposed to high-temperature hydrogenated water

2014 ◽  
Vol 89 ◽  
pp. 41-44 ◽  
Author(s):  
D.K. Schreiber ◽  
M.J. Olszta ◽  
S.M. Bruemmer
Keyword(s):  
High Temperature ◽  
Grain Boundary ◽  
Selective Oxidation ◽  
Binary Alloy ◽  
And Migration

Increased Thermal Stability of Co-silicide Using Co-Ta Alloy Films

2001 ◽  
Vol 670 ◽  
Author(s):  
Min-Joo Kim ◽  
Hyo-Jick Choi ◽  
Dae-Hong Ko ◽  
Ja-Hum Ku ◽  
Siyoung Choi ◽  
...  
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Grain Boundary ◽  
Reaction Rate ◽  
Boundary Migration ◽  
Grain Boundary Migration ◽  
Alloy Films ◽  
Post Annealing ◽  
Alloy Process ◽  
Thermal Stability Of

ABSTRACTThe silicidation reactions and thermal stability of Co silicide formed from Co-Ta/Si systems have been investigated. In case of Co-Ta alloy process, the formation of low resistive CoSi2phase is delayed to about 660°C, as compared to conventional Co/Si system. Moreover, the presence of Ta in Co-Ta alloy films reduces the silicidation reaction rate, resulting in the strong preferential orientation in CoSi2 films. Upon high temperature post annealing in the furnace, the sheet resistance of Co-silicide formed from Co/Si systems increases significantly, while that of Co-Ta/Si systems maintains low. This is due to the formation of TaSi2 at the grain boundaries and surface of Co-silicide films, which prevents the grain boundary migration thereby slowing the agglomeration. Therefore, from our research, increased thermal stability of Co-silicide films was successfully obtained from Co-Ta alloy process.

Grain-boundary cavity growth during high-temperature creep and fatigue

Metal Science ◽  
1981 ◽  
Vol 15 (2) ◽  
pp. 73-78 ◽  
Author(s):  
K. U. Snowden ◽  
D. S. Hughes ◽  
P. A. Stathers
Keyword(s):  
High Temperature ◽  
Grain Boundary ◽  
Cavity Growth ◽  
High Temperature Creep ◽  
Temperature Creep
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