Use of the reverse pulse plating method to improve the properties of cobalt–molybdenum electrodeposits

Surface and Coatings Technology ◽

10.1016/j.surfcoat.2006.04.011 ◽

2006 ◽

Vol 201 (6) ◽

pp. 2351-2357 ◽

Author(s):

Eva Pellicer ◽

Elvira Gómez ◽

Elisa Vallés

Keyword(s):

Pulse Plating ◽

Plating Method ◽

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Direct/reverse pulse plating rectifier

Metal Finishing ◽

10.1016/0026-0576(95)94366-8 ◽

1995 ◽

Vol 93 (4) ◽

pp. 84-85

Keyword(s):

Pulse Plating ◽

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Reverse pulse plating of copper from acid electrolyte: A rotating ring disc electrode study

Journal of Applied Electrochemistry ◽

10.1007/bf01024364 ◽

1987 ◽

Vol 17 (5) ◽

pp. 977-982 ◽

Author(s):

James R. White

Keyword(s):

Pulse Plating ◽

Acid Electrolyte ◽

Disc Electrode ◽

Reverse Pulse ◽

Rotating Ring Disc Electrode

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Filling through holes and blind microvias with copper using reverse pulse plating and insoluble anodes

Circuit World ◽

10.1108/03056121211250632 ◽

2012 ◽

Vol 38 (3) ◽

pp. 113-123 ◽

Author(s):

Bernd Roelfs ◽

Nina Dambrowsky ◽

Christof Erben ◽

Stephen Kenny

Keyword(s):

Pulse Plating ◽

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Electrodeposition using reverse pulse plating

Metal Finishing ◽

10.1016/s0026-0576(02)80255-0 ◽

2002 ◽

Vol 100 (4) ◽

pp. 109-110

Keyword(s):

Pulse Plating ◽

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From thin cores to outer layers: Filling through holes and blind micro vias with copper by reverse pulse plating

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270556 ◽

2009 ◽

Author(s):

Stephen Kenny ◽

Bernd Roelfs

Keyword(s):

Pulse Plating ◽

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Multicriteria optimization of mechanical and morphological properties of chromium electrodeposits under reverse pulse plating

Journal of Applied Electrochemistry ◽

10.1007/s10800-007-9320-6 ◽

2007 ◽

Vol 37 (7) ◽

pp. 843-852 ◽

Author(s):

L. Hallez ◽

M. De Petris-Wery ◽

M. Assoul ◽

M. Feki ◽

H. F. Ayedi

Keyword(s):

Multicriteria Optimization ◽

Pulse Plating ◽

Morphological Properties ◽

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A pulse plating method for the electrosynthesis of ZnSe

Journal of Applied Electrochemistry ◽

10.1007/s10800-006-9141-z ◽

2006 ◽

Vol 36 (7) ◽

pp. 821-826 ◽

Author(s):

M. Bouroushian ◽

T. Kosanovic ◽

N. Spyrellis

Keyword(s):

Pulse Plating ◽

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Electrochemical tailoring of Pb-free Sn coatings modified with SiC nanoparticles by surfactant-assisted reverse pulse plating

Applied Surface Science ◽

10.1016/j.apsusc.2021.149335 ◽

2021 ◽

Vol 550 ◽

pp. 149335

Author(s):

Ashutosh Sharma ◽

Byungmin Ahn

Keyword(s):

Pulse Plating ◽

Sic Nanoparticles ◽

Reverse Pulse ◽

Surfactant Assisted

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Ni-Mo Alloys with a High Molybdenum Content Using Pulse-Plating Method

Denki Kagaku oyobi Kogyo Butsuri Kagaku ◽

10.5796/kogyobutsurikagaku.66.754 ◽

1998 ◽

Vol 66 (7) ◽

pp. 754-756 ◽

Author(s):

Seichi RENGAKUJI ◽

Takakazu TAKANO ◽

Yuuko NAKAMURA ◽

Susumu IKENO ◽

Choichiro SHIMASAKI

Keyword(s):

Pulse Plating ◽

Molybdenum Content ◽

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Fe-Pt Thick Films Prepared by a Pulse Plating Method

2016 International Conference of Asian Union of Magnetics Societies (ICAUMS) ◽

10.1109/icaums.2016.8479770 ◽

2016 ◽

Author(s):

T. Masaki ◽

T. Yanai ◽

K. Furutani ◽

M. Nakano ◽

H. Fukunaga

Keyword(s):

Thick Films ◽

Pulse Plating ◽

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