2009 International Conference on Electronic Packaging Technology & High Density Packaging
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Published By IEEE

9781424446582
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

250W QCW conduction cooled high power semiconductor laser

2009 ◽  
Author(s):  
Jingwei Wang ◽  
Zhenbang Yuan ◽  
Yanxin Zhang ◽  
Entao Zhang ◽  
Di Wu ◽  
...  
Keyword(s):  
Semiconductor Laser ◽  
High Power ◽  
Power Semiconductor

Research on self-constrained sintering low-temperature cofired ceramic

2009 ◽  
Author(s):  
Yongda Hu ◽  
Taohua Liang ◽  
Yuanxun Li ◽  
Bangchao Yang ◽  
Yun Lu
Keyword(s):  
Low Temperature ◽  
Constrained Sintering

Collaborative effect between additives and current in TSV via filling process

2009 ◽  
Author(s):  
Kaihe Zou ◽  
Huiqin Ling ◽  
Qi Li ◽  
Haiyong Cao ◽  
Xianxian Yu ◽  
...  
Keyword(s):  
Filling Process

Effect of Zn addition on microstructure of Sn-Bi joint

2009 ◽  
Author(s):  
Q. S. Zhu ◽  
H. Y. Song ◽  
H. Y. Liu ◽  
Z. G. Wang ◽  
J. K. Shang
Keyword(s):  
Zn Addition

Modeling of thermal phenomena in a high power diode laser package

2009 ◽  
Author(s):  
Ephraim Suhir ◽  
Jingwei Wang ◽  
Zhenbang Yuan ◽  
Xu Chen ◽  
Xingsheng Liu
Keyword(s):  
Diode Laser ◽  
High Power ◽  
Thermal Phenomena ◽  
Power Diode ◽  
High Power Diode Laser
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