2009 International Conference on Electronic Packaging Technology & High Density Packaging
Latest Publications

TOTAL DOCUMENTS

269

(FIVE YEARS 0)

H-INDEX

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Published By IEEE

9781424446582

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

250W QCW conduction cooled high power semiconductor laser

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270711 ◽

2009 ◽

Cited By ~ 2

Author(s):

Jingwei Wang ◽

Zhenbang Yuan ◽

Yanxin Zhang ◽

Entao Zhang ◽

Di Wu ◽

...

Keyword(s):

Semiconductor Laser ◽

High Power ◽

Power Semiconductor

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Research on self-constrained sintering low-temperature cofired ceramic

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270545 ◽

2009 ◽

Author(s):

Yongda Hu ◽

Taohua Liang ◽

Yuanxun Li ◽

Bangchao Yang ◽

Yun Lu

Keyword(s):

Low Temperature ◽

Constrained Sintering

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Prediction of bending reliability of BGA solder joints on Flexible Printed Circuit (FPC)

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270618 ◽

2009 ◽

Cited By ~ 3

Author(s):

Jianlin Huang ◽

Quayle Chen ◽

Leon Xu ◽

G. Q. Zhang

Keyword(s):

Solder Joints ◽

Printed Circuit ◽

Flexible Printed Circuit

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Integration of GaN thin film and dissimilar substrate material by Au-Sn wafer bonding and CMP

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270705 ◽

2009 ◽

Author(s):

Shengjun Zhou ◽

Zhaohui Chen ◽

Bin Cao ◽

Sheng Liu

Keyword(s):

Thin Film ◽

Wafer Bonding ◽

Substrate Material

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The effect of tape casting slurry system for process performance of green ceramic tape used for electronic packaging

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270635 ◽

2009 ◽

Author(s):

Pengyuan Shi ◽

Caihua Ren ◽

Huajiang Jin ◽

Ling Gao

Keyword(s):

Electronic Packaging ◽

Tape Casting ◽

Process Performance ◽

Slurry System ◽

Ceramic Tape

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Modeling of copper wire bonding ball transient temperature behavior

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270720 ◽

2009 ◽

Author(s):

Techun Wang ◽

QingYi Zheng ◽

Rui Yu ◽

Zhongyun Li

Keyword(s):

Copper Wire ◽

Wire Bonding ◽

Temperature Behavior ◽

Transient Temperature ◽

Copper Wire Bonding

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A novel wafer level package strategy for RF MEMS

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270766 ◽

2009 ◽

Author(s):

Zheng Wang ◽

Zewen Liu

Keyword(s):

Rf Mems ◽

Wafer Level ◽

Wafer Level Package

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Collaborative effect between additives and current in TSV via filling process

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270783 ◽

2009 ◽

Cited By ~ 5

Author(s):

Kaihe Zou ◽

Huiqin Ling ◽

Qi Li ◽

Haiyong Cao ◽

Xianxian Yu ◽

...

Keyword(s):

Filling Process

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Effect of Zn addition on microstructure of Sn-Bi joint

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270582 ◽

2009 ◽

Author(s):

Q. S. Zhu ◽

H. Y. Song ◽

H. Y. Liu ◽

Z. G. Wang ◽

J. K. Shang

Keyword(s):

Zn Addition

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Modeling of thermal phenomena in a high power diode laser package

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270716 ◽

2009 ◽

Cited By ~ 1

Author(s):

Ephraim Suhir ◽

Jingwei Wang ◽

Zhenbang Yuan ◽

Xu Chen ◽

Xingsheng Liu

Keyword(s):

Diode Laser ◽

High Power ◽

Thermal Phenomena ◽

Power Diode ◽

High Power Diode Laser

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2009 International Conference on Electronic Packaging Technology & High Density PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

250W QCW conduction cooled high power semiconductor laser

Research on self-constrained sintering low-temperature cofired ceramic

Prediction of bending reliability of BGA solder joints on Flexible Printed Circuit (FPC)

Integration of GaN thin film and dissimilar substrate material by Au-Sn wafer bonding and CMP

The effect of tape casting slurry system for process performance of green ceramic tape used for electronic packaging

Modeling of copper wire bonding ball transient temperature behavior

A novel wafer level package strategy for RF MEMS

Collaborative effect between additives and current in TSV via filling process

Effect of Zn addition on microstructure of Sn-Bi joint

Modeling of thermal phenomena in a high power diode laser package

2009 International Conference on Electronic Packaging Technology & High Density Packaging
Latest Publications