From thin cores to outer layers: Filling through holes and blind micro vias with copper by reverse pulse plating

2009 ◽  
Author(s):  
Stephen Kenny ◽  
Bernd Roelfs
Keyword(s):  
Pulse Plating ◽  
Reverse Pulse

Filling through holes and blind microvias with copper using reverse pulse plating and insoluble anodes

Circuit World ◽  
2012 ◽  
Vol 38 (3) ◽  
pp. 113-123 ◽  
Author(s):  
Bernd Roelfs ◽  
Nina Dambrowsky ◽  
Christof Erben ◽  
Stephen Kenny
Keyword(s):  
Pulse Plating ◽  
Reverse Pulse

Corrosion behaviour of chromium coatings obtained by direct and reverse pulse plating electrodeposition in NaCl aqueous solution

2014 ◽  
Vol 78 ◽  
pp. 251-259 ◽  
Author(s):  
N. Imaz ◽  
M. Ostra ◽  
M. Vidal ◽  
J.A. Díez ◽  
M. Sarret ◽  
...  
Keyword(s):  
Aqueous Solution ◽  
Corrosion Behaviour ◽  
Pulse Plating ◽  
Reverse Pulse

scholarly journals Influence of Pulse Current Forward-Reverse Duty Cycle on Structure and Performance of Electroplated W–Cu Composite Coatings

Materials ◽  
2021 ◽  
Vol 14 (5) ◽  
pp. 1233
Author(s):  
Yuchao Zhao ◽  
Nan Ye ◽  
Haiou Zhuo ◽  
Chaolong Wei ◽  
Weiwei Zhou ◽  
...  
Keyword(s):  
Composite Coating ◽  
Duty Cycle ◽  
Electrode Materials ◽  
Pulse Current ◽  
Electrical Discharge Machining ◽  
Composite Coatings ◽  
Electrical Contact ◽  
Pulse Plating ◽  
Fusion Welding ◽  
Raw Material

Tungsten-copper (W–Cu) composites are widely used as electrical contact materials, resistance welding, electrical discharge machining (EDM), and plasma electrode materials due to their excellent arc erosion resistance, fusion welding resistance, high strength, and superior hardness. However, the traditional preparation methods pay little attention to the compactness and microstructural uniformity of W–Cu composites. Herein, W–Cu composite coatings are prepared by pulse electroplating using nano-W powder as raw material and the influence of forward-reverse duty cycle of pulse current on the structure and mechanical properties is systematically investigated. Moreover, the densification mechanism of the W–Cu composite coating is analyzed from the viewpoints of forward-pulse plating and reverse-pulse plating. At the current density (J) of 2 A/dm2, frequency (f) of 1500 Hz, forward duty cycle (df) of 40% and reverse duty cycle (dr) of 10%, the W–Cu composite coating rendered a uniform microstructure and compact structure, resulting in a hardness of 127 HV and electrical conductivity of 53.7 MS/m.

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