Grain boundary diffusion in thin films with a bimodal grain boundary structure

2012 ◽  
Vol 520 (6) ◽  
pp. 2362-2367 ◽  
Author(s):  
A. Makovec ◽  
G. Erdélyi ◽  
D.L. Beke
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion ◽  
Boundary Structure ◽  
Grain Boundary Structure

Ti and Ni Grain Boundary Diffusion in B2 NiTi Compound

2015 ◽  
Vol 363 ◽  
pp. 137-141 ◽  
Author(s):  
Dan Dan Liu ◽  
Jochen Fiebig ◽  
Martin Peterlechner ◽  
Simon Trubel ◽  
Matthias Wegner ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion ◽  
Boundary Structure ◽  
Segregation Coefficient ◽  
Radiotracer Technique ◽  
Grain Boundary Structure ◽  
Boundary Diffusion Coefficient ◽  
Boundary Triple ◽  
Boundary Width

The radiotracer technique was used to measure the grain boundary diffusion of44Ti and63Ni in slightly Ni-rich polycrystalline NiTi compound in the temperature range of 673 - 923 K. The temperature dependence of the grain boundary triple productP(P=sδDgb,sis the segregation coefficient,δis the grain boundary width, andDgbis the grain boundary diffusion coefficient) for Ti and Ni was determined. The triple products of both Ti and Ni grain boundary diffusion in NiTi reveal a unique behavior with significant deviations from an Arrhenius-type dependence. Probable evolution of the grain boundary structure with temperature was used to interpret this phenomenon.

scholarly journals Synthesis of high-entropy alloy thin films via grain boundary diffusion–assisted solid-state alloying

2022 ◽  
Vol 207 ◽  
pp. 114302
Author(s):  
Seungjin Nam ◽  
Sang Jun Kim ◽  
Moon J. Kim ◽  
Manuel Quevedo-Lopez ◽  
Jun Yeon Hwang ◽  
...  
Keyword(s):  
Thin Films ◽  
Solid State ◽  
Grain Boundary ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion ◽  
High Entropy Alloy ◽  
High Entropy

Grain Boundary Diffusion in Co/Cu and Co/Cr Magnetic Thin Films

1993 ◽  
Vol 313 ◽  
Author(s):  
John G. Holl-Pellerin ◽  
S.G.H. Anderson ◽  
P.S. Ho ◽  
K.R. Coffey ◽  
J.K. Howard ◽  
...  
Keyword(s):  
Thin Films ◽  
Activation Energy ◽  
Diffusion Coefficient ◽  
Grain Boundary ◽  
Photoelectron Spectroscopy ◽  
Boundary Diffusion ◽  
Magnetic Thin Films ◽  
Grain Boundary Diffusion ◽  
X Ray ◽  
Before And After

ABSTRACTX-ray photoelectron spectroscopy (XPS) has been used to investigate grain boundary diffusion of Cu and Cr through 1000 Å thick Co films in the temperature range of 325°C to 400°C. Grain boundary diffusivities were determined by modeling the accumulation of Cu or Cr on Co surfaces as a function of time at fixed annealing temperature. The grain boundary diffusivity of Cu through Co is characterized by a diffusion coefficient, D0gb, of 2 × 104 cm2/sec and an activation energy, Ea,gb, of 2.4 eV. Similarly, Cr grain boundary diffusion through Co thin films occurs with a diffusion coefficient, Do,gb, of 6 × 10-2cm2/sec and an activation energy, Ea,gb of 1.8 eV. The Co film microstructure has been investigated before and after annealing by x-ray diffraction and transmission electron Microscopy. Extensive grain growth and texturing of the film occurred during annealing for Co deposited on a Cu underlayer. In contrast, the microstructure of Co deposited on a Cr underlayer remained relatively unchanged upon annealing. Magnetometer Measurements have shown that increased in-plane coercivity Hc, reduced remanence squareness S, and reduced coercive squareness S* result from grain boundary diffusion of Cu and Cr into the Co films.

Grain‐boundary diffusion in thin films: I. The isolated grain boundary

1976 ◽  
Vol 47 (9) ◽  
pp. 3792-3798 ◽  
Author(s):  
G. H. Gilmer ◽  
H. H. Farrell
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion

Analysis of grain‐boundary diffusion in thin films: Chromium in gold

1976 ◽  
Vol 47 (9) ◽  
pp. 3769-3775 ◽  
Author(s):  
P. H. Holloway ◽  
D. E. Amos ◽  
G. C. Nelson
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion
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