Effects of fin geometry on boiling heat transfer from silicon chips with micro-pin-fins immersed in FC-72

International Journal of Heat and Mass Transfer ◽

10.1016/s0017-9310(03)00226-6 ◽

2003 ◽

Vol 46 (21) ◽

pp. 4059-4070 ◽

Author(s):

J.J. Wei ◽

H. Honda

Keyword(s):

Heat Transfer ◽

Boiling Heat Transfer ◽

Silicon Chips ◽

Pin Fins ◽

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Boiling Heat Transfer from Silicon Chips with Micro-Pin-Fins Immersed in FC-72. Combined Effects of Fin Height and Fin Thickness.

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B ◽

10.1299/kikaib.69.682 ◽

2003 ◽

Vol 69 (679) ◽

pp. 682-689 ◽

Author(s):

JinJia WEI ◽

Hiroshi HONDA

Keyword(s):

Heat Transfer ◽

Boiling Heat Transfer ◽

Combined Effects ◽

Silicon Chips ◽

Pin Fins ◽

Fin Thickness ◽

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Subcooled flow boiling heat transfer of FC-72 from silicon chips fabricated with micro-pin-fins

International Journal of Thermal Sciences ◽

10.1016/j.ijthermalsci.2008.11.018 ◽

2009 ◽

Vol 48 (7) ◽

pp. 1416-1422 ◽

Author(s):

Minzhe Yuan ◽

Jinjia Wei ◽

Yanfang Xue ◽

Jiabin Fang

Keyword(s):

Heat Transfer ◽

Boiling Heat Transfer ◽

Flow Boiling ◽

Subcooled Flow Boiling ◽

Silicon Chips ◽

Subcooled Flow ◽

Flow Boiling Heat Transfer ◽

Pin Fins ◽

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Enhanced Boiling Heat Transfer from Silicon Chips with Micro-Pin Fins Immersed in FC-72

Journal of Enhanced Heat Transfer ◽

10.1615/jenhheattransf.v10.i2.70 ◽

2003 ◽

Vol 10 (2) ◽

pp. 211-224 ◽

Author(s):

Hiroshi Honda ◽

Hiroshi Takamatsu ◽

J. J. Wei

Keyword(s):

Heat Transfer ◽

Boiling Heat Transfer ◽

Silicon Chips ◽

Pin Fins ◽

Enhanced Boiling ◽

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Experimental study of saturated flow boiling heat transfer in an array of staggered micro-pin-fins

International Journal of Heat and Mass Transfer ◽

10.1016/j.ijheatmasstransfer.2008.10.008 ◽

2009 ◽

Vol 52 (7-8) ◽

pp. 1853-1863 ◽

Author(s):

Weilin Qu ◽

Abel Siu-Ho

Keyword(s):

Heat Transfer ◽

Experimental Study ◽

Boiling Heat Transfer ◽

Flow Boiling ◽

Saturated Flow ◽

Flow Boiling Heat Transfer ◽

Pin Fins ◽

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Experimental study of boiling heat transfer in a microchannel with nucleated-shape columnar micro-pin-fins

International Communications in Heat and Mass Transfer ◽

10.1016/j.icheatmasstransfer.2019.104277 ◽

2019 ◽

Vol 108 ◽

pp. 104277 ◽

Author(s):

Wun-Rong Liao ◽

Liang-Han Chien ◽

Mohammad Ghalambaz ◽

Wei-Mon Yan

Keyword(s):

Heat Transfer ◽

Experimental Study ◽

Boiling Heat Transfer ◽

Pin Fins ◽

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Boiling of FC-72 on Silicon Chips with Micro-Pin-Fins and Submicron-Scale Roughness.

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B ◽

10.1299/kikaib.68.519 ◽

2002 ◽

Vol 68 (666) ◽

pp. 519-526 ◽

Author(s):

Hiroshi HONDA ◽

Hiroshi TAKAMATSU ◽

Jinjia WEI

Keyword(s):

Silicon Chips ◽

Submicron Scale ◽

Pin Fins ◽

Micro Pin Fins ◽

Scale Roughness

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Heat transfer and fluid flow characteristics of combined microchannel with cone-shaped micro pin fins

International Communications in Heat and Mass Transfer ◽

10.1016/j.icheatmasstransfer.2017.11.004 ◽

2018 ◽

Vol 92 ◽

pp. 78-89 ◽

Author(s):

Yuting Jia ◽

Guodong Xia ◽

Yifan Li ◽

Dandan Ma ◽

Bo Cai

Keyword(s):

Heat Transfer ◽

Flow Characteristics ◽

Pin Fins ◽

Fluid Flow Characteristics ◽

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Heat transfer enhancement from micro pin fins subjected to an impinging jet

International Journal of Heat and Mass Transfer ◽

10.1016/j.ijheatmasstransfer.2011.09.037 ◽

2012 ◽

Vol 55 (1-3) ◽

pp. 413-421 ◽

Author(s):

Sidy Ndao ◽

Hee Joon Lee ◽

Yoav Peles ◽

Michael K. Jensen

Keyword(s):

Heat Transfer ◽

Heat Transfer Enhancement ◽

Impinging Jet ◽

Transfer Enhancement ◽

Pin Fins ◽

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Experimental study on convective boiling flow and heat transfer in a microgap enhanced with a staggered arrangement of nucleated micro-pin-fins

International Journal of Heat and Mass Transfer ◽

10.1016/j.ijheatmasstransfer.2019.118653 ◽

2019 ◽

Vol 144 ◽

pp. 118653 ◽

Author(s):

Liang-Han Chien ◽

Wun-Rong Liao ◽

Mohammad Ghalambaz ◽

Wei-Mon Yan

Keyword(s):

Heat Transfer ◽

Experimental Study ◽

Convective Boiling ◽

Flow And Heat Transfer ◽

Pin Fins ◽

Staggered Arrangement ◽

Boiling Flow ◽

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Numerical Analysis on the Heat Transfer of Heatsink with Micro-Pin-Fins

ECS Transactions ◽

10.1149/05201.0759ecst ◽

2013 ◽

Vol 52 (1) ◽

pp. 759-764 ◽

Author(s):

H.-C. Chiu ◽

R.-H. Hsieh ◽

J.-H. Jang

Keyword(s):

Heat Transfer ◽

Numerical Analysis ◽

Pin Fins ◽

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