Surface Plasmonic Lasing in Micro-Nanostructures of Silicon Excited by using Pulsed Infrared Lasers

Surface plasmon is a possible candidate to break the diffraction limit and open the door for developing nanolasers on silicon chips. A new step in this development involves the choice of the structures and compositions for better surface plasmonic emission. The micro-nanostructures were fabricated by using a nanosecond pulsed laser on silicon surface, in which the surface plasmonic emission is stronger. The group of emission peaks with multiple-longitudinal-mode occurs in the optical gain curve. Interestingly, the quantum energy of surface plasmon with 140[Formula: see text]meV has been measured at first, which is related to the peak interval (about 62[Formula: see text]nm) of longitudinal modes in the surface plasmonic lasing spectra. The surface plasmonic lasing near 865[Formula: see text]nm was observed in the Purcell cavity with Si–Cr–Si layers excited by using pulsed lasers at 1064[Formula: see text]nm. Surface plasmonic structure induced with photons was observed by using the reflection Talbot effect image, in which the mechanism of the surface plasmonic lasing can be explored. The physical model of the surface plasmonic laser has been built on the energy levels of the micro-nanostructures of Si.

Digital Control of Active Network Microstructures on Silicon Wafers

This chapter presents a promising digital control of active microstructures developed and tested on silicon chips by current division and thus independent Joule heating powers, especially for planar submillimeter two-dimensional (2-D) grid microstructures built on silicon wafers by surface microfabrication. Current division on such 2-D grid networks with 2 × 2, 3 × 3, and n × n loops was modeled and analyzed theoretically by employing Kirchhoff’s voltage law (KVL) and Kirchhoff’s current law (KCL), which demonstrated the feasibility of active control of the networks by Joule heating effect. Furthermore, in situ testing of a typical 2-D microstructure with 2 × 2 loops by different DC sources was carried out, and the thermomechanical deformation due to Joule heating was recorded. As a result, active control of the current division has been proven to be a reliable and efficient approach to achieving the digital actuation of 2-D microstructures on silicon chips. Digital control of such microstructural networks on silicon chips envisions great potential applications in active reconfigurable buses for microrobots and flexible electronics.

Recent Insights and Multifactorial Applications of Carbon Nanotubes

Nanotechnology has undergone significant development in recent years, particularly in the fabrication of sensors with a wide range of applications. The backbone of nanotechnology is nanostructures, which are determined on a nanoscale. Nanoparticles are abundant throughout the universe and are thought to be essential building components in the process of planet creation. Nanotechnology is generally concerned with structures that are between 1 and 100 nm in at least one dimension and involves the production of materials or electronics that are that small. Carbon nanotubes (CNTs) are carbon-based nanomaterials that have the structure of tubes. Carbon nanotubes are often referred to as the kings of nanomaterials. The diameter of carbon is determined in nanometers. They are formed from graphite sheets and are available in a variety of colors. Carbon nanotubes have a number of characteristics, including high flexibility, good thermal conductivity, low density, and chemical stability. Carbon nanotubes have played an important part in nanotechnology, semiconductors, optical and other branches of materials engineering owing to their remarkable features. Several of the applications addressed in this review have already been developed and used to benefit people worldwide. CNTs have been discussed in several domains, including industry, construction, adsorption, sensors, silicon chips, water purifiers, and biomedical uses, to show many treatments such as injecting CNTs into kidney cancers in rats, drug delivery, and directing a near-infrared laser at the cancers. With the orderly development of research in this field, additional therapeutic modalities will be identified, mainly for dispersion and densification techniques and targeted drug delivery systems for managing and curing posterior cortical atrophy. This review discusses the characteristics of carbon nanotubes as well as therapeutic applications such as medical diagnostics and drug delivery.

Creation of micro-and nanochannels on the surface of silicon chips by lithography methods and investigation of ion transport in channel

We developed a technique for fabrication microfluidic silicon-glass chips with a system of nanochannels connecting two microchannel using traditional optical lithography and a focused ion beam. To investigate the transport phenomena in the nanochannels we experimentally studied their ion conductivity and using optical microscopy confirmed the existence of the diffusion flow through them. The developed method allows us to create systems of nanochannels with on-purpose geometry and controlled sizes. Devices with such nanochannels can be applied in the creation of biosensor devices and for genetic studies.

Microchip Transfer Process for Implantable Flexible Bioelectronic Devices

The demands on flexible implants for recording of neural signals and electrical stimulating have increased in recent years with regard to their functionality, miniaturization, and spatial resolution. These requirements can be met best by embedding powerful complementary metal oxide semiconductor (CMOS) microchips into thin biocompatible polymer substrates. So-called chip-in-foil systems thus combine mechanical properties of a polymer substrate and performance of CMOS technology. The development of a process for direct transfer of multiple CMOS microchips (edge length <400 μm) simultaneously into thin polyimide (PI) substrates is subject of this study. It allows the use of standard microelectromechanical systems (MEMS) processes for further levelled superficial layer build-up. This is achieved with the help of a silicon carrier wafer equipped with cavities for precise chip placement and a sacrificial layer to facilitate release of the chip-in-foil systems. In a post-processing step all silicon chips are thinned down to 100 μm. With this process a transfer yield of 100 % (n = 34) was achieved for the silicon chips on a die level. Chip rotational error on substrates was determined to be as low as 0.21° ± 0.10°. Die adhesion was examined by shear tests, resulting in shear strength of 58.1 MPa ± 13.7 MPa, which dropped to 15.2 MPa ± 10.5 MPa after accelerated ageing in 60 °C phosphate buffered saline solution (PBS) for 16 days (equivalent to 78 days at 37 °C). This study demonstrated a reliable microchip transfer process with low positioning error into flexible PI substrates with post-processing thinning of the dies. The use of a carrier silicon wafer allowed precise electrical interconnect fabrication with standard MEMS processing techniques and without handling of thin and fragile chips. These results are a prerequisite to meet needs of reliability and structural biocompatibility in implantable flexible bioelectronic devices.

Integrating magnetic capabilities to intracellular chips for cell trapping

Current microtechnologies have shown plenty of room inside a living cell for silicon chips. Microchips as barcodes, biochemical sensors, mechanical sensors and even electrical devices have been internalized into living cells without interfering their cell viability. However, these technologies lack from the ability to trap and preconcentrate cells in a specific region, which are prerequisites for cell separation, purification and posterior studies with enhanced sensitivity. Magnetic manipulation of microobjects, which allows a non-contacting method, has become an attractive and promising technique at small scales. Here, we show intracellular Ni-based chips with magnetic capabilities to allow cell enrichment. As a proof of concept of the potential to integrate multiple functionalities on a single device of this technique, we combine coding and magnetic manipulation capabilities in a single device. Devices were found to be internalized by HeLa cells without interfering in their viability. We demonstrated the tagging of a subpopulation of cells and their subsequent magnetic trapping with internalized barcodes subjected to a force up to 2.57 pN (for magnet-cells distance of 4.9 mm). The work opens the venue for future intracellular chips that integrate multiple functionalities with the magnetic manipulation of cells.

Hybrid Systems-in-Foil

Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.