Supercritical combustion synthesis of titanium nitride

1996 ◽  
Vol 26 (2) ◽  
pp. 1875-1881 ◽  
Author(s):  
K. Brezinsky ◽  
J.A. Brehm ◽  
C.K. Law ◽  
I. Glassman
Keyword(s):  
Titanium Nitride ◽  
Combustion Synthesis ◽  
Supercritical Combustion

ChemInform Abstract: Simultaneous Synthesis and Densification of Titanium Nitride by High Pressure Combustion Synthesis.

ChemInform ◽  
2001 ◽  
Vol 32 (9) ◽  
pp. no-no
Author(s):  
R. M. Marin-Ayral ◽  
C. Pascal ◽  
F. Martinez ◽  
J. C. Tedenac
Keyword(s):  
High Pressure ◽  
Titanium Nitride ◽  
Combustion Synthesis ◽  
Simultaneous Synthesis

Effect of nitrogen pressure on the combustion synthesis of titanium nitride

2000 ◽  
Vol 18 (1-6) ◽  
pp. 331-338 ◽  
Author(s):  
C. Pascal ◽  
R. M. Marin-Ayral ◽  
F. Martinez ◽  
J. C. Tedenac
Keyword(s):  
Titanium Nitride ◽  
Combustion Synthesis ◽  
Nitrogen Pressure

Effect of Porosity on the Combustion Synthesis of Titanium Nitride

1990 ◽  
Vol 73 (5) ◽  
pp. 1235-1239 ◽  
Author(s):  
Maryam Eslamloo-Grami ◽  
Zuhair A. Munir
Keyword(s):  
Titanium Nitride ◽  
Combustion Synthesis

Fluidized-bed combustion synthesis of titanium nitride

2000 ◽  
Vol 28 (1) ◽  
pp. 1373-1380 ◽  
Author(s):  
Kyeong-Ook Lee ◽  
Jon J. Cohen ◽  
Kenneth Brezinsky
Keyword(s):  
Titanium Nitride ◽  
Combustion Synthesis ◽  
Fluidized Bed ◽  
Fluidized Bed Combustion

Evolution of the microstructure of Cu(Ti)/SiO2 layers annealed in NH3

1995 ◽  
Vol 53 ◽  
pp. 452-453
Author(s):  
J. Liu ◽  
N. D. Theodore ◽  
D. Adams ◽  
S. Russell ◽  
T. L. Alford ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Titanium Nitride ◽  
Large Scale ◽  
Standard Procedure ◽  
Alloy Film ◽  
Electron Beam Evaporation ◽  
Copper Metallization ◽  
Nominal Composition ◽  
Ti Alloy ◽  
Thermally Grown

Copper-based metallization has recently attracted extensive research because of its potential application in ultra-large-scale integration (ULSI) of semiconductor devices. The feasibility of copper metallization is, however, limited due to its thermal stability issues. In order to utilize copper in metallization systems diffusion barriers such as titanium nitride and other refractory materials, have been employed to enhance the thermal stability of copper. Titanium nitride layers can be formed by annealing Cu(Ti) alloy film evaporated on thermally grown SiO2 substrates in an ammonia ambient. We report here the microstructural evolution of Cu(Ti)/SiO2 layers during annealing in NH3 flowing ambient.The Cu(Ti) films used in this experiment were prepared by electron beam evaporation onto thermally grown SiO2 substrates. The nominal composition of the Cu(Ti) alloy was Cu73Ti27. Thermal treatments were conducted in NH3 flowing ambient for 30 minutes at temperatures ranging from 450°C to 650°C. Cross-section TEM specimens were prepared by the standard procedure.

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