Enhancement of the critical current across a YBCO thin-film grain boundary junction due to Abrikosov vortices

2002 ◽  
Vol 366 (4) ◽  
pp. 245-253 ◽  
Author(s):  
K.-H. Müller ◽  
E.E. Mitchell ◽  
J. Herrmann ◽  
D.B. Lowe ◽  
C. Andrikidis ◽  
...  
Keyword(s):  
Thin Film ◽  
Grain Boundary ◽  
Critical Current ◽  
Ybco Thin Film ◽  
Abrikosov Vortices

scholarly journals Mechanisms of critical current limitation in YBCO thin film structures

1998 ◽  
Vol 24 (7) ◽  
pp. 468-470 ◽  
Author(s):  
Š. Beňačka ◽  
V. Štrbik ◽  
Š. Chromik ◽  
R. Adam ◽  
M. Darula ◽  
...  
Keyword(s):  
Thin Film ◽  
Critical Current ◽  
Ybco Thin Film ◽  
Current Limitation

Vortex channel flow effect in grain boundary of YBCO thin film under inclined magnetic field

2018 ◽  
Vol 554 ◽  
pp. 15-18
Author(s):  
Tao Hua ◽  
Mei Yu ◽  
Haifeng Geng ◽  
Weiwei Xu ◽  
Yapeng Lu ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Thin Film ◽  
Grain Boundary ◽  
Channel Flow ◽  
Inclined Magnetic Field ◽  
Ybco Thin Film ◽  
Flow Effect

Critical current in YBCO thin film bridge studied using magneto-optic technique

1993 ◽  
Vol 6 (3) ◽  
pp. 173-178 ◽  
Author(s):  
M. V. Indenbom ◽  
A. Forkl ◽  
H. Kronm�ller ◽  
H. -U. Habermeier
Keyword(s):  
Thin Film ◽  
Critical Current ◽  
Ybco Thin Film ◽  
Magneto Optic

Angular dependence of the critical current density and the temperature scaling of the flux pinning force in YBCO thin film

2018 ◽  
Vol 56 (2) ◽  
pp. 754-759
Author(s):  
Abdelhalim Hafid ◽  
Ahmed Taoufik ◽  
Abella Bouaaddi ◽  
Hassan Elouaddi ◽  
Ahmed Tirbiyine ◽  
...  
Keyword(s):  
Thin Film ◽  
Critical Current Density ◽  
Critical Current ◽  
Angular Dependence ◽  
Current Density ◽  
Flux Pinning ◽  
Pinning Force ◽  
Ybco Thin Film ◽  
Temperature Scaling ◽  
Flux Pinning Force

Josephson effect and small-angle grain boundary in YBCO thin film bridge

1991 ◽  
Vol 27 (2) ◽  
pp. 3320-3323 ◽  
Author(s):  
H. Suzuki ◽  
H. Kurosawa ◽  
K. Miyagawa ◽  
Y. Hirotsu ◽  
M. Era ◽  
...  
Keyword(s):  
Thin Film ◽  
Grain Boundary ◽  
Small Angle ◽  
Josephson Effect ◽  
Ybco Thin Film

Microstructural characterization of YBa2Cu3O7-x thin films formed by metalorganic CVD

1991 ◽  
Vol 49 ◽  
pp. 1080-1081
Author(s):  
P. Lu ◽  
W. Huang ◽  
C.S. Chern ◽  
Y.Q. Li ◽  
J. Zhao ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Critical Current Density ◽  
Critical Current ◽  
Current Density ◽  
Film Growth ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Ion Milling ◽  
Conventional Grinding

The YBa2Cu3O7-x thin films formed by metalorganic chemical vapor deposition(MOCVD) have been reported to have excellent superconducting properties including a sharp zero resistance transition temperature (Tc) of 89 K and a high critical current density of 2.3x106 A/cm2 or higher. The origin of the high critical current in the thin film compared to bulk materials is attributed to its structural properties such as orientation, grain boundaries and defects on the scale of the coherent length. In this report, we present microstructural aspects of the thin films deposited on the (100) LaAlO3 substrate, which process the highest critical current density.Details of the thin film growth process have been reported elsewhere. The thin films were examined in both planar and cross-section view by electron microscopy. TEM sample preparation was carried out using conventional grinding, dimpling and ion milling techniques. Special care was taken to avoid exposure of the thin films to water during the preparation processes.

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

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