Thermal Atomic Layer Etching of Nickel Using Sequential Chlorination and Ligand-Addition Reactions

2021 ◽  
Author(s):  
Jessica A. Murdzek ◽  
Ann Lii-Rosales ◽  
Steven M. George
Keyword(s):  
Atomic Layer ◽  
Addition Reactions ◽  
Atomic Layer Etching ◽  
Ligand Addition

Damaged silicon contact layer removal using atomic layer etching for deep-nanoscale semiconductor devices

2013 ◽  
Vol 31 (6) ◽  
pp. 061310 ◽  
Author(s):  
Jong Kyu Kim ◽  
Sung Il Cho ◽  
Sung Ho Lee ◽  
Chan Kyu Kim ◽  
Kyung Suk Min ◽  
...  
Keyword(s):  
Semiconductor Devices ◽  
Atomic Layer ◽  
Contact Layer ◽  
Layer Removal ◽  
Atomic Layer Etching

Understanding time-resolved processes in atomic-layer etching of ultra-thin Al2O3 film using BCl3 and Ar neutral beam

2014 ◽  
Vol 105 (9) ◽  
pp. 093104 ◽  
Author(s):  
Young I. Jhon ◽  
Kyung S. Min ◽  
G. Y. Yeom ◽  
Young Min Jhon
Keyword(s):  
Atomic Layer ◽  
Neutral Beam ◽  
Al2o3 Film ◽  
Time Resolved ◽  
Atomic Layer Etching

(Invited) Volatile Products during Thermal Atomic Layer Etching of Metal Oxides and Elemental Metals

2021 ◽  
Vol MA2021-01 (21) ◽  
pp. 844-844
Author(s):  
Ann Lii-Rosales ◽  
Virginia Johnson ◽  
Sandeep Sharma ◽  
Andrew S Cavanagh ◽  
Steven M George
Keyword(s):  
Metal Oxides ◽  
Atomic Layer ◽  
Volatile Products ◽  
Atomic Layer Etching

Prediction and Validation of the Process Window for Atomic Layer Etching: HF Exposure on TiO2

2021 ◽  
Author(s):  
Suresh Kondati Natarajan ◽  
Austin M. Cano ◽  
Jonathan L. Partridge ◽  
Steven M. George ◽  
Simon D. Elliott
Keyword(s):  
Atomic Layer ◽  
Process Window ◽  
Atomic Layer Etching

scholarly journals Predicting synergy in atomic layer etching

2017 ◽  
Vol 35 (5) ◽  
pp. 05C302 ◽  
Author(s):  
Keren J. Kanarik ◽  
Samantha Tan ◽  
Wenbing Yang ◽  
Taeseung Kim ◽  
Thorsten Lill ◽  
...  
Keyword(s):  
Atomic Layer ◽  
Atomic Layer Etching

Thermal Atomic Layer Etching of Silicon Using O2, HF, and Al(CH3)3 as the Reactants

2018 ◽  
Vol 30 (23) ◽  
pp. 8465-8475 ◽  
Author(s):  
Aziz I. Abdulagatov ◽  
Steven M. George
Keyword(s):  
Atomic Layer ◽  
Atomic Layer Etching

scholarly journals Axial Addition in Diastereoisomeric [Ni(Me8[14]ane)](ClO4)2 Complexes and Their Antifungal Activities

2021 ◽  
Vol 41 (1) ◽  
pp. 122-147
Author(s):  
D Palit ◽  
L Dey ◽  
S Rabi ◽  
S Roy ◽  
A Alam ◽  
...  
Keyword(s):  
Phytopathogenic Fungi ◽  
Axial Ligand ◽  
Addition Reactions ◽  
Antifungal Activities ◽  
Conductance Data ◽  
Square Planar ◽  
Square Planar Complexes ◽  
Ligand Addition

A series of diastereoisomeric square planar nickel(II) diperchlorate complexes, [Ni(L)](ClO4)2{L= isomeric Me8[14]ane (LAα, LBα or LCα)}undergo axial ligand addition reactions with NO3-, Cl-, Br-, SCN- or ClO4- to yield six coordinate octahedral derivatives [NiL(X)x(Y)y].z(H2O)(X=NO3,Cl, Br or SCN; Y= ClO4; x = 1 or 2; y = 1 or 0 and z = 0, 1 or 2). The products have been characterized on the basis of analytical, spectroscopic, magnetic and conductance data. All the derivatives are unstable in open air except one derivative and revert back to original square planar complexes. Antifungal activities of the ligands and their nickel(II) complexes  have been investigated against some phytopathogenic fungi. The Chittagong Univ. J. Sci. 40(1) : 122-147, 2019

scholarly journals Fluorocarbon assisted atomic layer etching of SiO2 and Si using cyclic Ar/C4F8 and Ar/CHF3 plasma

2016 ◽  
Vol 34 (1) ◽  
pp. 01B101 ◽  
Author(s):  
Dominik Metzler ◽  
Chen Li ◽  
Sebastian Engelmann ◽  
Robert L. Bruce ◽  
Eric A. Joseph ◽  
...  
Keyword(s):  
Atomic Layer ◽  
Atomic Layer Etching
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