Characterization of sign-out in pediatric acute care wards to inform process improvement

Author(s):  
Richard M. D. Sledd ◽  
Ellen J. Bass ◽  
Stephen M. Borowitz ◽  
Linda A. Waggoner-Fountain
Author(s):  
Richard M. D. Sledd ◽  
Ellen J. Bass ◽  
Stephen M. Borowitz ◽  
Linda A. Waggoner-Fountain

Author(s):  
Ellen J. Bass ◽  
Linda A. Waggoner-Fountain ◽  
M. S. Richard Sledd ◽  
M. S. Justin DeVoge ◽  
Stephen M. Borowitz

2015 ◽  
Vol 1792 ◽  
Author(s):  
Steve H. Kilgore

ABSTRACTProcess-induced defects in electroplated Au interconnect metallization on GaAs devices were detected during the course of reliability testing. Abnormally high lognormal sigma values (σ > 0.7) indicated the existence of a bi-modal failure mechanism. A distinct early lifetime failure mode was observed along with the intrinsic electromigration metallization wear-out failure mode. Physical characterization of the electroplated Au film revealed as-deposited nanoscale voids. Elimination of these voids through process improvement as well as suggested mechanisms for the early failures are discussed.


2019 ◽  
Vol 101 (1) ◽  
pp. 30-37 ◽  
Author(s):  
M. Sansone ◽  
Å. Wiman ◽  
M.L. Karlberg ◽  
M. Brytting ◽  
L. Bohlin ◽  
...  

2019 ◽  
Vol 74 (4) ◽  
pp. S33
Author(s):  
J. McCready ◽  
D. Albright ◽  
E. Schaller ◽  
L. Salazar ◽  
S. Putnam ◽  
...  

Author(s):  
Richard M. D. Sledd ◽  
Ellen J. Bass ◽  
Stephen M. Borowitz ◽  
Linda A. Waggoner-Fountain
Keyword(s):  

2010 ◽  
Vol 19 (6) ◽  
pp. e61-e61
Author(s):  
A. M. Yancey ◽  
A. B. Jundt ◽  
K. J. Nelson

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