Reliability Detection of Process-Induced Metallization Defects in GaAs Devices
Keyword(s):
Au Film
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ABSTRACTProcess-induced defects in electroplated Au interconnect metallization on GaAs devices were detected during the course of reliability testing. Abnormally high lognormal sigma values (σ > 0.7) indicated the existence of a bi-modal failure mechanism. A distinct early lifetime failure mode was observed along with the intrinsic electromigration metallization wear-out failure mode. Physical characterization of the electroplated Au film revealed as-deposited nanoscale voids. Elimination of these voids through process improvement as well as suggested mechanisms for the early failures are discussed.
Keyword(s):
1979 ◽
Vol 29
(1)
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pp. 374-380
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Keyword(s):
1993 ◽
Vol 268
(3)
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pp. 2075-2082
1983 ◽
Vol 258
(5)
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pp. 3166-3172
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