Enhancing C–C bond formation by surface strain: a computational investigation for C2 and C3 intermediate formation on strained Cu surfaces

2019 ◽  
Vol 21 (41) ◽  
pp. 22704-22710 ◽  
Author(s):  
Yu-Te Chan ◽  
I-Shou Huang ◽  
Ming-Kang Tsai

In this study, 121 copper(100) models with surface strain are used for simulating C–C bond formation by CO2 electrochemical reduction.

2020 ◽  
Vol 8 (44) ◽  
pp. 23162-23186
Author(s):  
Yansong Zhou ◽  
Boon Siang Yeo

Recent advances in non-Cu catalysts for electrochemical reduction of CO2 to multi-carbon products are summarized, focusing on C–C bond formation mechanisms.


2009 ◽  
Vol 625 (2) ◽  
pp. 138-143
Author(s):  
Joji Ohshita ◽  
Koichi Hino ◽  
Tomonori Iwawaki ◽  
Atsutaka Kunai

ACS Catalysis ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 2422-2434
Author(s):  
Shi-Qin Xiang ◽  
Jun-Lin Shi ◽  
Shu-Ting Gao ◽  
Wei Zhang ◽  
Liu-Bin Zhao

ChemCatChem ◽  
2015 ◽  
Vol 7 (15) ◽  
pp. 2309-2312 ◽  
Author(s):  
Emanuela Di Santo ◽  
Marta E. Alberto ◽  
Nino Russo ◽  
Marirosa Toscano

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