Enhancing C–C bond formation by surface strain: a computational investigation for C2 and C3 intermediate formation on strained Cu surfaces
2019 ◽
Vol 21
(41)
◽
pp. 22704-22710
◽
Keyword(s):
In this study, 121 copper(100) models with surface strain are used for simulating C–C bond formation by CO2 electrochemical reduction.
Keyword(s):
2016 ◽
Vol 7
(8)
◽
pp. 1471-1477
◽
Keyword(s):
2009 ◽
Vol 625
(2)
◽
pp. 138-143
Keyword(s):
Keyword(s):