scholarly journals Reduction of formaldehyde emission from urea-formaldehyde resin with a small quantity of graphene oxide

RSC Advances ◽  
2021 ◽  
Vol 11 (52) ◽  
pp. 32830-32836
Author(s):  
Kazuki Saito ◽  
Yasushi Hirabayashi ◽  
Shinya Yamanaka

This is the first experiment to demonstrate that GO effectively prevents formaldehyde emission from UF resin.

2011 ◽  
Vol 197-198 ◽  
pp. 147-150 ◽  
Author(s):  
Wei Wang ◽  
Li Bin Zhu ◽  
Ji You Gu ◽  
Xiang Li Weng ◽  
Hai Yan Tan

Through the study of the effects of different dosage of additives on the properties of urea formaldehyde resin adhesive prepared at low mole ratio of formaldehyde/urea, optimize the synthetic process of the UF resin which is used at the E0 grade plywood. The results showed that the product synthesized under the following condition: the mole ratio of formaldehyde/urea is 0.99:1, the dosage of the specific additive is 1.0% and that of melamine is 3-4%, had a good comprehensive performance and the formaldehyde emission of the plywood meets the E0 grade which is environmental-friendly.


2011 ◽  
Vol 71-78 ◽  
pp. 3170-3173
Author(s):  
Ji Zhi Zhang ◽  
Xiao Ying Liu ◽  
Ying Ying Qiu ◽  
Xiao Mei Wang ◽  
Jian Zhang Li ◽  
...  

Urea-formaldehyde resin was modified by a modifier with different synthetic processes labelled as UFM1, UFM2, and UFM3 respectively. As a comparison, normal UF resin with a F/U molar ratio of 1.1 labelled as UF0 was synthesized. The thermal behavior of modified urea-formaldehyde resins was studied by TG-DTA techniques, and the properties of plywood bonded with the UFM resins were investigated. The conclusions were as follows: (1) the modifier used in this study could significantly reduce the free formaldehyde content of urea-formaldehyde resin and the formaldehyde emission of plywood; (2) The exothermic peak temperatures of DTA curve were 129.37, 125.05, 120.98, and 116.11 °C for UF0, UFM1, UFM2, and UFM3 respectively. (3) The plywood manufactured with UFM2 and UFM3 resins have high bonding strength (1.28MPa and 1.59MPa) and low formaldehyde emission value (E1 grade).


RSC Advances ◽  
2021 ◽  
Vol 11 (40) ◽  
pp. 25010-25017
Author(s):  
Li Lu ◽  
Yan Wang ◽  
Tianhua Li ◽  
Supeng Wang ◽  
Shoulu Yang ◽  
...  

Reactions between CaCO3 and CH2O2 during polycondensation of UF resin produce Ca2+. Ionic bond complexation binds Ca2+ with UF resin. The UF resin crystalline percentage decreases from 26.86% to 22.71%. IB strength of resin bonded fiberboard increases from 0.75 to 0.94 MPa.


Wood Research ◽  
2021 ◽  
Vol 66 (6) ◽  
pp. 1015-1031
Author(s):  
JAKUB KAWALERCZYK ◽  
JOANNA SIUDA ◽  
DOROTA DZIURKA ◽  
RADOSŁAW MIRSKI ◽  
MAGDALENA WOŹNIAK ◽  
...  

Formaldehyde emission still remains a major disadvantage of widely applied formaldehyde-containing amino resins such as UF (urea-formaldehyde) resin and MUF (melamine-urea-formaldehyde) resin. The compositions of adhesives for plywood manufacturing have to contain a proper extenders in order to adjust their viscosity. Thus, the aim of the study was to investigate the effect of protein-rich soy flour (SF) as the extender for adhesives. The composition of flours and their ability to absorb the formaldehyde were determined. Properties of liquid resins such as gel time, viscosity, pH and solid content were investigated. The possible chemical interaction between the extenders and resins were assessed with the use of FTIR spectroscopy. Plywood panels manufactured using UF and MUF adhesives with the soy flour introduced as the extender in various concentrations were tested in terms of shear strength and formaldehyde release. Studies have shown that soy flour has a favorable composition and formaldehyde-scavenging ability. The addition of SF affected resins properties such as viscosity and gel time but showed no influence on their pH and solid content. FTIR analysis has not explained the chemical interaction between resin and extender. The application of soy flour in the concentration of 15% for UF resin and 10% for MUF resin allowed to produce plywood characterized by improved bonding quality and decreased formaldehyde emission.


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