Transmission characteristics of multi‐walled carbon nanotube‐based through‐silicon vias considering temperature effects

2017 ◽  
Vol 11 (10) ◽  
pp. 1424-1431
Author(s):  
Jinrong Su ◽  
Xinwei Chen ◽  
Liping Han ◽  
Rongcao Yang ◽  
Wenmei Zhang
Keyword(s):  
Carbon Nanotube ◽  
Temperature Effects ◽  
Transmission Characteristics ◽  
Through Silicon Vias ◽  
Multi Walled Carbon Nanotube ◽  
Silicon Vias

scholarly journals Low-loss shielded through-silicon vias filled with multi-walled carbon nanotube bundle

2016 ◽  
Vol 58 ◽  
pp. 83-88 ◽  
Author(s):  
Jinrong Su ◽  
Runbo Ma ◽  
Xinwei Chen ◽  
Liping Han ◽  
Rongcao Yang ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Low Loss ◽  
Through Silicon Vias ◽  
Multi Walled Carbon Nanotube ◽  
Silicon Vias ◽  
Nanotube Bundle

Modeling of Carbon Nanotube-Based Differential Through-Silicon Vias in 3-D ICs

2020 ◽  
Vol 19 ◽  
pp. 492-499 ◽  
Author(s):  
Wen-Sheng Zhao ◽  
Qing-Hao Hu ◽  
Kai Fu ◽  
Yuan-Yuan Zhang ◽  
Da-Wei Wang ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Through Silicon Vias ◽  
Silicon Vias

Investigation of Carbon Nanotube-Based Through-Silicon Vias for PDN Applications

2018 ◽  
Vol 60 (3) ◽  
pp. 738-746 ◽  
Author(s):  
Jing Jin ◽  
Wen-Sheng Zhao ◽  
Da-Wei Wang ◽  
Hong-Sheng Chen ◽  
Er-Ping Li ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Through Silicon Vias ◽  
Silicon Vias
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