Numerical analysis of electronic substrate cooling by pumping nanoencapsulated phase change material slurry through micro-channels etched on the substrate
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2003 ◽
Vol 10
(3)
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pp. 311-322
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2020 ◽
pp. 359-370
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2012 ◽
Vol 16
(4)
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pp. 80-86
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2005 ◽
Vol 31
(2)
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pp. 151-158
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