scholarly journals Surface structure chemical transfer method to fabricate low reflectance multi-crystalline Si wafers produced with fixed abrasive machining technology

AIP Advances ◽  
2019 ◽  
Vol 9 (5) ◽  
pp. 055224
Author(s):  
Shogo Kunieda ◽  
Kentaro Imamura ◽  
Hikaru Kobayashi
Keyword(s):  
Surface Structure ◽  
Abrasive Machining ◽  
Chemical Transfer ◽  
Transfer Method ◽  
Fixed Abrasive

Surface Structure Chemical Transfer Method for Formation of Ultralow Reflectivity Si Surfaces

2013 ◽  
Vol 160 (8) ◽  
pp. H443-H445 ◽  
Author(s):  
Masao Takahashi ◽  
Takashi Fukushima ◽  
Yuuki Seino ◽  
Woo-Byoung Kim ◽  
Kentaro Imamura ◽  
...  
Keyword(s):  
Surface Structure ◽  
Chemical Transfer ◽  
Transfer Method

Ultra-low reflectivity polycrystalline silicon surfaces formed by surface structure chemical transfer method

2013 ◽  
Vol 103 (1) ◽  
pp. 013110 ◽  
Author(s):  
Kentaro Imamura ◽  
Francisco C. Franco ◽  
Taketoshi Matsumoto ◽  
Hikaru Kobayashi
Keyword(s):  
Surface Structure ◽  
Polycrystalline Silicon ◽  
Silicon Surfaces ◽  
Chemical Transfer ◽  
Transfer Method

Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Large Grains

2009 ◽  
Vol 69-70 ◽  
pp. 253-257
Author(s):  
Ping Zhao ◽  
Jia Jie Chen ◽  
Fan Yang ◽  
K.F. Tang ◽  
Ju Long Yuan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicon Wafer ◽  
Processing Parameters ◽  
Wafer Surface ◽  
Abrasive Machining ◽  
Fixed Abrasive ◽  
Is Failure ◽  
Better Than

Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.

Effect of Fabrication Conditions on Ultra-Fine Abrasive Polishing Pad

2012 ◽  
Vol 565 ◽  
pp. 302-306 ◽  
Author(s):  
Yun He Zhang ◽  
Jing Lu ◽  
Hui Huang ◽  
Xi Peng Xu
Keyword(s):  
Reaction Time ◽  
Environmental Pollution ◽  
Sol Gel ◽  
Abrasive Machining ◽  
Drying Method ◽  
Polishing Pad ◽  
Tool Performance ◽  
Alginate Concentration ◽  
Fixed Abrasive ◽  
Free Abrasive

Considering the grit aggregation of fixed abrasive and the environmental pollution of free abrasive machining tools, a kind of ultra-fine abrasive polishing pad was fabricated by means of sol-gel technology. The effects of drying method, gel reaction time, sodium alginate concentration and pad thickness which determine the property of the polishing pad were respectively investigated. And the polishing pad fabricated under the optimized condition was utilized to polish silicon wafer on a nano-polishing machine to evaluate the tool performance.

A semi-fixed abrasive machining technique

2009 ◽  
Vol 19 (5) ◽  
pp. 054006 ◽  
Author(s):  
Julong Yuan ◽  
Zhiwei Wang ◽  
Tao Hong ◽  
Qianfa Deng ◽  
Donghui Wen ◽  
...  
Keyword(s):  
Abrasive Machining ◽  
Fixed Abrasive

Process Parameters Influence on Semi-Fixed Abrasive Tool Wear

2011 ◽  
Vol 325 ◽  
pp. 251-256
Author(s):  
Qian Fa Deng ◽  
Ping Zhao ◽  
Bing Hai Lv ◽  
Ju Long Yuan ◽  
Zhi Wei Wang
Keyword(s):  
Process Parameters ◽  
Influencing Factor ◽  
Single Crystal Silicon ◽  
Abrasive Tool ◽  
Abrasive Machining ◽  
Advanced Ceramics ◽  
Crystal Silicon ◽  
Abrasive Tools ◽  
Ceramics Industry ◽  
Fixed Abrasive

Abrasive machining is an important process for the manufacturing of advanced ceramics. The demand for advanced ceramics with better quality and higher efficiency presents tremendous challenges for abrasive tools in the advanced ceramics industry. The concept of semi-fixed abrasive machining with a newly developed semi-fixed abrasive tool (SFAT) as machining tool is put forward. This paper presents an experimental investigation for SFAT wear into course of machining single crystal silicon with SFAT. Process parameters (water flow, load and velocity) influencing the SFAT wear are analyzed. Influencing factor of SFAT wear in processing course has been clearly demonstrated.

Semi-Fixed Abrasive Machining for Plane Aluminium

2009 ◽  
Vol 416 ◽  
pp. 103-107 ◽  
Author(s):  
Ju Long Yuan ◽  
Jia Jie Chen ◽  
Zhi Wei Wang ◽  
Dong Qiang Yu
Keyword(s):  
Surface Roughness ◽  
Removal Efficiency ◽  
Ferrous Metal ◽  
Abrasive Machining ◽  
Metal Material ◽  
Comprehensive Performance ◽  
Paper Plane ◽  
Fixed Abrasive ◽  
Better Than

Aluminum is a non-ferrous metal material which has excellent comprehensive performance. It has been widely used in many sectors. In this paper, plane abrasive machining is carried out for the aluminum. The quality of the Al specimen’s surface is compared after the semi-fixed and loose abrasive processing. The experiment proved that semi-fixed abrasive machining is better than loose abrasive in reducing surface roughness of Al-blocks. In the semi-fixed abrasive machining, the surface roughness of Al-block continued to drop and become stable after 40 minutes. It can prevent deep scratches on Al-blocks’ surface effectively and can get a mirror effect. The surface roughness can reach to Ra 22nm, Rmax 490nm, Rv 130nm. Its removal efficiency is also higher than loose abrasive machining. It is proved that semi-fixed abrasive machining can take the place of rough polishing processing.

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