scholarly journals Measuring the surface bonding energy: A comparison between the classical double-cantilever beam experiment and its nanoscale analog

AIP Advances ◽  
2020 ◽  
Vol 10 (4) ◽  
pp. 045006
Author(s):  
K. Pantzas ◽  
F. Fournel ◽  
A. Talneau ◽  
G. Patriarche ◽  
E. Le Bourhis
2015 ◽  
Vol 665 ◽  
pp. 101-104
Author(s):  
Michal K. Budzik ◽  
Henrik M. Jensen

We analyzed effects of interface/adhesive defects during fracture mechanical Mode I Double Cantilever Beam (DCB) tests of an adhesive joint. Two aluminium slabs were bonded using structural epoxy adhesive. A DCB experiment under static loading was conducted to estimate the critical fracture energy. During the ‘steady-state’ fracture we noted oscillating, random fluctuation in the force vs. displacement curve, and thus in the fracture energy. This is associated to the local variation of properties within the bondline and the interfaces. A simple model is derived to quantify the probable density of flaws observed experimentally.


1998 ◽  
Vol 32 (24) ◽  
pp. 2203-2225 ◽  
Author(s):  
Bhavani V. Sankar ◽  
Sreerama M. Dharmapuri

2000 ◽  
Vol 123 (2) ◽  
pp. 191-197 ◽  
Author(s):  
Y. Shindo ◽  
K. Horiguchi ◽  
R. Wang ◽  
H. Kudo

An experimental and analytical investigation in cryogenic Mode I interlaminar fracture behavior and toughness of SL-E woven glass-epoxy laminates was conducted. Double cantilever beam (DCB) tests were performed at room temperature (R.T.), liquid nitrogen temperature (77 K), and liquid helium temperature (4 K) to evaluate the effect of temperature and geometrical variations on the interlaminar fracture toughness. The fracture surfaces were examined by scanning electron microscopy to verify the fracture mechanisms. A finite element model was used to perform the delamination crack analysis. Critical load levels and the geometric and material properties of the test specimens were input data for the analysis which evaluated the Mode I energy release rate at the onset of delamination crack propagation. The results of the finite element analysis are utilized to supplement the experimental data.


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