Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging

The Journal of Adhesion ◽

10.1080/00218464.2012.725621 ◽

2013 ◽

Vol 89 (1) ◽

pp. 19-36 ◽

Author(s):

Hui-wang Cui ◽

Qiong Fan ◽

Dong-sheng Li ◽

Xin Tang

Keyword(s):

Electronic Packaging ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Electrically Conductive Adhesives For Electronic Packaging And Assembly Applications

Electrically Conductive Adhesives ◽

10.1163/ej.9789004165922.i-426.25 ◽

2010 ◽

pp. 39-56

Author(s):

L. J. Matienzo ◽

F. D. Egitto ◽

R. N. Das

Keyword(s):

Electronic Packaging ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications

Electrically Conductive Adhesives ◽

10.1201/b12245-6 ◽

2008 ◽

pp. 47-64

Keyword(s):

Electronic Packaging ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Oxidation Prevention and Electrical Property Enhancements of Copper-filled Electrically Conductive Adhesives for Electronic Packaging and Interconnection

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373780 ◽

2007 ◽

Author(s):

Myung Jin Yim ◽

Yi Li ◽

Kyoung Sik Moon ◽

C. P. Wong

Keyword(s):

Electrical Property ◽

Electronic Packaging ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications

Journal of Adhesion Science and Technology ◽

10.1163/156856108x305444 ◽

2008 ◽

Vol 22 (8-9) ◽

pp. 853-869 ◽

Author(s):

L. J. Matienzo ◽

R. N. Das ◽

F. D. Egitto

Keyword(s):

Electronic Packaging ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Characterization of Electrically Conductive Adhesives

Energy Procedia ◽

10.1016/j.egypro.2012.07.128 ◽

2012 ◽

Vol 27 ◽

pp. 676-679 ◽

Author(s):

U. Eitner ◽

T. Geipel ◽

S.-N. Holtschke ◽

M. Tranitz

Keyword(s):

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Linear viscoelastic characterization of electrically conductive adhesives used as interconnect in photovoltaic modules

Progress in Photovoltaics Research and Applications ◽

10.1002/pip.3257 ◽

2020 ◽

Vol 28 (7) ◽

pp. 659-681 ◽

Author(s):

Martin Springer ◽

Nick Bosco

Keyword(s):

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives ◽

Photovoltaic Modules ◽

Linear Viscoelastic

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Study on the Electrical Property of Silver (Ag) Nanoparticles Filled Epoxy Composites for the Application of Electrically Conductive Adhesives (ECAs) in Electronic Packaging

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456501 ◽

2006 ◽

Author(s):

D. I. Tee ◽

M. Mariatti ◽

C. H. See ◽

K. F. Chong

Keyword(s):

Electrical Property ◽

Ag Nanoparticles ◽

Electronic Packaging ◽

Epoxy Composites ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Characterization of Organic/inorganic Interface in Electrically Conductive Adhesives Using Time-domain NMR Spectroscopy

Journal of Smart Processing ◽

10.7791/jspmee.7.184 ◽

2018 ◽

Vol 7 (5) ◽

pp. 184-191 ◽

Author(s):

Masahiro INOUE ◽

Tomohito NEGISHI

Keyword(s):

Nmr Spectroscopy ◽

Time Domain ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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A Review on Electrically Conductive Adhesives in Electronic Packaging

International Journal for Research in Applied Science and Engineering Technology ◽

10.22214/ijraset.2021.34685 ◽

2021 ◽

Vol 9 (IX) ◽

pp. 440-452

Author(s):

Kevin George

Keyword(s):

Electronic Packaging ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Characterization of SiO2/Ag composite particles synthesized by in situ reduction and its application in electrically conductive adhesives

Materials & Design ◽

10.1016/j.matdes.2015.06.036 ◽

2015 ◽

Vol 83 ◽

pp. 745-752 ◽

Author(s):

Chao Xu ◽

Wen-jun Li ◽

Ying-min Wei ◽

Xiao-ying Cui

Keyword(s):

Composite Particles ◽

In Situ Reduction ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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