Journal of Smart Processing
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Published By "Sumart Processing Society For Materials, Environment And Energy"

2187-1337, 2186-702x
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scholarly journals Nano-hydroxyapatite Coating Improves Bioactivity of Additively Manufactured Ti-6Al-4V Alloy Surface

2021 ◽  
Vol 10 (4) ◽  
pp. 251-255
Author(s):  
Ryota WATANABE ◽  
Hiroyuki TAKAHASHI ◽  
Toru UEMUKAI ◽  
Yasumichi KOGAI ◽  
Aira MATSUGAKI ◽  
...  
Keyword(s):  
Hydroxyapatite Coating ◽  
Alloy Surface

scholarly journals Fabrication of Copper Alloys as Conductive Materials via Laser Beam Powder Bed Fusion

2021 ◽  
Vol 10 (4) ◽  
pp. 265-269
Author(s):  
Ryosuke OZASA ◽  
Mridul GUPTA ◽  
Takuya ISHIMOTO ◽  
Aira MATSUGAKI ◽  
Tetsuji KUSE ◽  
...  
Keyword(s):  
Laser Beam ◽  
Copper Alloys ◽  
Powder Bed Fusion ◽  
Powder Bed ◽  
Conductive Materials

scholarly journals Preparation of Mono-sized ZrO 2 Particles by Freeze-dry Pulsated Orifice Ejection Method

2021 ◽  
Vol 10 (4) ◽  
pp. 224-229
Author(s):  
Mingqi DONG ◽  
Naohiro YASUDA ◽  
Kouki NISHIGAKI ◽  
Weiwei ZHOU ◽  
Naoyuki NOMURA
Keyword(s):  
Ejection Method

scholarly journals Investigation of Mechanical Properties of High Tg Epoxy Resin Material

2021 ◽  
Vol 10 (6) ◽  
pp. 365-371
Author(s):  
Xinya ZHAO ◽  
Hironao MITSUGI ◽  
Ikuo SHOHJI ◽  
Tatsuya KOBAYASHI
Keyword(s):  
Mechanical Properties ◽  
Epoxy Resin

scholarly journals Deterioration Behavior of Epoxy Resin for Electronics Packaging and Its Adhesive Joint with Ni by Water Absorption

2021 ◽  
Vol 10 (6) ◽  
pp. 359-364
Author(s):  
Hironao MITSUGI ◽  
Riku SUZUKI ◽  
Ikuo SHOHJI ◽  
Tatsuya KOBAYASHI
Keyword(s):  
Water Absorption ◽  
Epoxy Resin ◽  
Adhesive Joint ◽  
Electronics Packaging

scholarly journals Influence of Free-Electron Density Distribution on Mechanical Strength in Micro-Welding of Glass by Picosecond Pulsed Laser

2021 ◽  
Vol 10 (5) ◽  
pp. 294-300
Author(s):  
Zhiyong OUYANG ◽  
Yasuhiro OKAMOTO ◽  
Kazuki IHORIYA ◽  
Akira OKADA
Keyword(s):  
Mechanical Strength ◽  
Density Distribution ◽  
Electron Density ◽  
Free Electron ◽  
Electron Density Distribution ◽  
Pulsed Laser ◽  
Free Electron Density

scholarly journals Finite Element Analysis of Delamination of Redistribution Layer in Semiconductor Package Structure

2021 ◽  
Vol 10 (5) ◽  
pp. 286-293
Author(s):  
Kenta ONO ◽  
Yoshiharu KARIYA
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Element Analysis
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