Oxidation Prevention and Electrical Property Enhancements of Copper-filled Electrically Conductive Adhesives for Electronic Packaging and Interconnection
2008 ◽
Vol 22
(8-9)
◽
pp. 853-869
◽
2015 ◽
Vol 3
(24)
◽
pp. 6178-6184
◽
2013 ◽
Vol 45
◽
pp. 132-137
◽
2013 ◽
Vol 89
(1)
◽
pp. 19-36
◽
2006 ◽
Vol 29
(1)
◽
pp. 173-178
◽
2021 ◽
Vol 9
(IX)
◽
pp. 440-452