Oxidation Prevention and Electrical Property Enhancements of Copper-filled Electrically Conductive Adhesives for Electronic Packaging and Interconnection

Author(s):  
Myung Jin Yim ◽  
Yi Li ◽  
Kyoung Sik Moon ◽  
C. P. Wong
2015 ◽  
Vol 3 (24) ◽  
pp. 6178-6184 ◽  
Author(s):  
Chaowei Li ◽  
Xike Gong ◽  
Lei Tang ◽  
Kai Zhang ◽  
Jie Luo ◽  
...  

Weak reducing and substituting agents were selected to treat Ag-coated-Cu flakes to increase the conductivity of Ag-coated-Cu based electrically conductive adhesives.


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