2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium
Latest Publications

TOTAL DOCUMENTS

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(FIVE YEARS 0)

Published By IEEE

9781424407293, 9781424407309

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456491 ◽

2006 ◽

Cited By ~ 3

Author(s):

A. Ourdjini ◽

M.A. Azmah Hanim ◽

S.F. Joyce Koh ◽

I. Siti Aisha ◽

K.S. Tan ◽

...

Keyword(s):

Surface Finish ◽

Interfacial Reactions ◽

Solder Volume

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Comprehensive Study of Epoxy Die Attach Process to Achieve Zero Reject Performance

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456459 ◽

2006 ◽

Author(s):

Lee Yee Sinn ◽

Tan Chee Eng

Keyword(s):

Die Attach ◽

Comprehensive Study

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Die Attach Epoxy Delamination Study on Low RDs(on) Device

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456481 ◽

2006 ◽

Author(s):

Tan Chip King

Keyword(s):

Die Attach

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Thermal Performance Prediction of QFN Packages using Artificial Neural Network (ANN)

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456431 ◽

2006 ◽

Cited By ~ 6

Author(s):

RC Law ◽

Raymond Cheang ◽

YW Tan ◽

I.A Azid

Keyword(s):

Neural Network ◽

Artificial Neural Network ◽

Thermal Performance ◽

Performance Prediction ◽

Artificial Neural ◽

Artificial Neural Network Ann

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Film Assisted Molding on MEMS Packages

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456473 ◽

2006 ◽

Author(s):

Frank Boschman

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Assessment of Solder Joint Fatigue Performance Using Cyclic Flexural Loading

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456440 ◽

2006 ◽

Author(s):

M.N. Tamin ◽

Y.B. Liew ◽

A.N.R. Wagiman ◽

W.K. Loh

Keyword(s):

Solder Joint ◽

Fatigue Performance ◽

Flexural Loading ◽

Solder Joint Fatigue

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Leadframe Mold Lock Study and Optimization for Flag Size Reduction using Finite Element Analysis and Reliability Testing for 3L SOT223 Package

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456485 ◽

2006 ◽

Author(s):

Muhammad Hanif Ahmad Fuad ◽

Azhar Aripin ◽

WL Chin

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Size Reduction ◽

Reliability Testing ◽

Element Analysis

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Design of Planar and 3-D Components using Photoimageable process

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456498 ◽

2006 ◽

Author(s):

M.S. Aftanasar ◽

C.Y. Ng ◽

P.R. Young ◽

I.D. Robertson

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Solder Fatigue Modeling of Flip-Chip Bumps in Molded Packages

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456441 ◽

2006 ◽

Cited By ~ 2

Author(s):

Kar Wei Shim ◽

Wai Yew Lo

Keyword(s):

Flip Chip ◽

Solder Fatigue ◽

Fatigue Modeling

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Nine-Element Lumped Metal-Insulator-Metal (MIM) Capacitor Model for RF Applications

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456489 ◽

2006 ◽

Cited By ~ 2

Author(s):

Kalavathi Subramaniam ◽

Albert Victor Kordesch ◽

Mazlina Esa

Keyword(s):

Metal Insulator ◽

Metal Insulator Metal ◽

Rf Applications

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2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology SymposiumLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish

Comprehensive Study of Epoxy Die Attach Process to Achieve Zero Reject Performance

Die Attach Epoxy Delamination Study on Low RDs(on) Device

Thermal Performance Prediction of QFN Packages using Artificial Neural Network (ANN)

Film Assisted Molding on MEMS Packages

Assessment of Solder Joint Fatigue Performance Using Cyclic Flexural Loading

Leadframe Mold Lock Study and Optimization for Flag Size Reduction using Finite Element Analysis and Reliability Testing for 3L SOT223 Package

Design of Planar and 3-D Components using Photoimageable process

Solder Fatigue Modeling of Flip-Chip Bumps in Molded Packages

Nine-Element Lumped Metal-Insulator-Metal (MIM) Capacitor Model for RF Applications

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium
Latest Publications