2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium
Latest Publications

TOTAL DOCUMENTS

95

(FIVE YEARS 0)

H-INDEX

6

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Published By IEEE

9781424407293, 9781424407309

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermal Performance Prediction of QFN Packages using Artificial Neural Network (ANN)

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456431 ◽

2006 ◽

Author(s):

RC Law ◽

Raymond Cheang ◽

YW Tan ◽

I.A Azid

Keyword(s):

Neural Network ◽

Artificial Neural Network ◽

Thermal Performance ◽

Performance Prediction ◽

Artificial Neural ◽

Artificial Neural Network Ann

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Film Assisted Molding on MEMS Packages

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456473 ◽

2006 ◽

Author(s):

Frank Boschman

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Assessment of Solder Joint Fatigue Performance Using Cyclic Flexural Loading

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456440 ◽

2006 ◽

Author(s):

M.N. Tamin ◽

Y.B. Liew ◽

A.N.R. Wagiman ◽

W.K. Loh

Keyword(s):

Solder Joint ◽

Fatigue Performance ◽

Flexural Loading ◽

Solder Joint Fatigue

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Leadframe Mold Lock Study and Optimization for Flag Size Reduction using Finite Element Analysis and Reliability Testing for 3L SOT223 Package

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456485 ◽

2006 ◽

Author(s):

Muhammad Hanif Ahmad Fuad ◽

Azhar Aripin ◽

WL Chin

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Size Reduction ◽

Reliability Testing ◽

Element Analysis

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Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456491 ◽

2006 ◽

Author(s):

A. Ourdjini ◽

M.A. Azmah Hanim ◽

S.F. Joyce Koh ◽

I. Siti Aisha ◽

K.S. Tan ◽

...

Keyword(s):

Surface Finish ◽

Interfacial Reactions ◽

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Comprehensive Study of Epoxy Die Attach Process to Achieve Zero Reject Performance

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456459 ◽

2006 ◽

Author(s):

Lee Yee Sinn ◽

Tan Chee Eng

Keyword(s):

Comprehensive Study

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Die Attach Epoxy Delamination Study on Low RDs(on) Device

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456481 ◽

2006 ◽

Author(s):

Tan Chip King

Keyword(s):

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Laser assisted soldering and Flip-Chip attach for 3-D packaging

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456437 ◽

2006 ◽

Author(s):

T. Oppert ◽

G. Azdasht ◽

E. Zakel ◽

T. Teutsch

Keyword(s):

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Towards Higher Reliability Challenge of Au-Al intermetalic system

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456451 ◽

2006 ◽

Author(s):

Yong Cheng Choi ◽

Siong Chin Teck ◽

Low Teck Poh ◽

Ho Poh Hoon ◽

Shirley Diong

Keyword(s):

Reliability Challenge

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Mold Die Design to Improve Flash Remains for Micro Miniature Package

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456471 ◽

2006 ◽

Author(s):

Ruan Jianhua ◽

Wang Yue ◽

Zhang Jingyuan ◽

Jerry Quah

Keyword(s):

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