Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications

2008 ◽  
Vol 22 (8-9) ◽  
pp. 853-869 ◽  
Author(s):  
L. J. Matienzo ◽  
R. N. Das ◽  
F. D. Egitto
2012 ◽  
Vol 52 (6) ◽  
pp. 1165-1173 ◽  
Author(s):  
Byung-Seung Yim ◽  
Yumi Kwon ◽  
Seung Hoon Oh ◽  
Jooheon Kim ◽  
Yong-Eui Shin ◽  
...  

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