Processing of IN718/Ti–6Al–4V bimetallic joint using transient liquid phase bonding: effect of bonding temperature on the microstructure and mechanical properties

Author(s):  
B. Binesh ◽  
M. Aghaie-Khafri ◽  
A. Fayegh
2017 ◽  
Vol 48 (7) ◽  
pp. 3343-3356 ◽  
Author(s):  
Monica Kapoor ◽  
Ömer N. Doğan ◽  
Casey S. Carney ◽  
Rajesh V. Saranam ◽  
Patrick McNeff ◽  
...  

2020 ◽  
Vol 12 (10) ◽  
pp. 168781402096653
Author(s):  
Yan Bi ◽  
Yong Nie ◽  
Qian Wang ◽  
Jian Han ◽  
Yangchuan Cai

Ultrasonic-assisted transient liquid phase bonding of pure Cu with Sn-In solder was realized at 140°C in air. Shear test was carried out on the weldment. The effect of ultrasonic vibration on microstructure and mechanical properties of the weld seam was studied. The relationship between the formation of intermetallic compounds and their mechanical properties was analyzed by means of electronic scanning and element analysis. (Sn) solid solution, ε(Cu3Sn), η(Cu6Sn5), Cu10Sn3, Cu11In9, Cu9In4, γ, β phase were detected in the weld seam. When the ultrasonic vibration time is 30 s, the shear strength reached a maximum of 22.76 MPa. The fracture occurred on the surface of the fine-grained η(Cu6Sn5) phase. The fracture surface was partially covered with coarse-grained Cu11In9 phase, which belonged to a brittle fracture.


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