Superplastic Forming and Reaction Diffusion Bonding Process of Hollow Structural Component for Mg-Gd-Y-Zn-Zr Rare Earth Magnesium Alloy

This work fabricated a double hollow structural component of Mg-8.3Gd-2.9Y-0.8Zn-0.2Zr alloy by superplastic forming (SPF) and reaction-diffusion bonding (RDB). The superplastic characteristic and mechanical properties of Mg-8.3Gd-2.9Y-0.8Zn-0.2Zr alloy sheets at 250–450 °C were studied. Tensile tests showed that the maximum elongation of tensile specimens was about 1276.3% at 400 °C under a strain rate of 1 × 10−3 s−1. Besides, the effect of bonding temperature and interface roughness on microstructure and mechanical properties of the reaction diffusion-bonded joints with a Cu interlayer was investigated. With the increase of temperature, the diffusion coefficient of Cu increases, and the diffusion transition region becomes wider, leading to tightening bonding of the joint. However, the bonding quality of the joint will deteriorate due to grain size growth at higher temperatures. Shear tests showed that the highest strength of the joints was 152 MPa (joint efficiency = 98.7%), which was performed at 460 °C.

Microstructure and Mechanical Properties of Vacuum Diffusion Bonded Zr-4 Alloy Joint

The development of welding technology for zirconium alloy has great significance on the safety, stability, and reliability of the operation of the nuclear reactor. In this work, vacuum diffusion bonding of Zr-4 alloy was studied at the diffusion temperature ranging from 760 to 820 °C with holding times of 30–90 min. The effects of diffusion bonding temperature and holding time on the interfacial microstructure and mechanical properties of the diffusion bonded Zr-4 alloy joints were investigated in detail, and the relationship between the interfacial microstructure and shear strength of the diffusion bonded joints was discussed. The results show that the interface bonding ratio of the diffusion bonded Zr-4 joint gradually increased from 74% to 95% with the increasing of bonding temperature. In addition, the grain size of the base material became a larger and brittle second phase composed of Zr(Cr, Fe)2 and eutectic α-Zr + Zr(Fe, Cr)2 formed in the joint with the increase of the temperature as well as the extension of the bonding time. The highest shear strength of 349 MPa was obtained at 800 °C for 30 min under 7 MPa, and the crack of the joint was primarily propagated along with the base material rather than the bonded interface.

Investigation on Processing Maps of Diffusion Bonding Process Parameters for Ti-6Al-4 V/AISI304 Dissimilar Joints

The diffusion bonding (DB) method is used in this investigation to connect high-temperature dissimilar materials. The existence of difficult-to-remove oxide coatings on the titanium surfaces, as well as the arrangement of breakable metallic interlayers and oxide enclosures inside the bond region, provides the most significant challenges during the transition from AISI304 to Ti-6Al-4V alloying. In addition, an effort was made to advance DB processing maps for the operational connection of Ti-6Al-4V to AISI304 alloys to improve their performance. Joints had been created by combining several process factors, such as bonding temperature (T), bonding pressure (P), and holding time (t), to create diverse designs. Based on the findings, database processing maps were created. This set of processing maps may be used as a rough guideline for selecting appropriate DB process parameters for generating virtuous excellent bonds between Ti-6Al-4V and AISI304 alloys. The maximum lap shear strength (LSS) was achieved at 800°C, 15 MPa, and 45 min.

Diffusion Bonding of FGH 98 and CoCrNi-Based Medium-Entropy Alloy: Microstructure Evolution and Mechanical Tests

The superalloy FGH98 was successfully diffusion bonded (DB) with medium-entropy alloy (MEA) Al3Ti3(CrCoNi)94 using pure Ni as the interlayer at a temperature range of 1050–1170 °C for 1 h under 5 MPa. The microstructure and mechanical properties of joints were investigated. The diffusion bonding seam was composed of an interlayer zone (IZ) and two diffusion-affected zones (DAZ). The IZ and DAZ beside the FGH98 consisted of cubic Ni3(TiAl)-type γ′ phases due to the diffusion of Ti and Al atoms. Meanwhile, the DAZ adjacent to the MEA consisted of spherical γ′ phases. Both of the γ′ phases with different morphology kept the coherent relationship with the matrix. Moreover, increase of bonding temperature led to the morphology of interlayer γ′ phase to transform from sphere to cube. Due to the strengthening effect of a mass of γ′ phase distributed evenly in IZ and the DAZ beside the FGH98, the microhardness and Young’s modulus of these two zones were higher than that of DAZ near the MEA. The maximum shear strength of DB joint, 592 MPa, was achieved in the joint bonded by 1150 °C, which was the typical ductile fracture feature confirmed by the shear dimples.

Fail-Safe Joints between Copper Alloy (C18150) and Nickel-Based Superalloy (GH4169) Made by Transient Liquid Phase (TLP) Bonding and Using Boron-Nickel (BNi-2) Interlayer

Joining heat conducting alloys, such as copper and its alloys, to heat resistant nickel-based superalloys has vast applications in nuclear power plants (including future fusion reactors) and liquid propellant launch vehicles. On the other hand, fusion welding of most dissimilar alloys tends to be unsuccessful due to incompatibilities in their physical properties and melting points. Therefore, solid-state processes, such as diffusion bonding, explosive welding, and friction welding, are considered and commercially used to join various families of dissimilar materials. However, the solid-state diffusion bonding of copper alloys normally results in a substantial deformation of the alloy under the applied bonding load. Therefore, transient liquid phase (TLP) bonding, which requires minimal bonding pressure, was considered to join copper alloy (C18150) to a nickel-based superalloy (GH4169) in this work. BNi-2 foil was used as an interlayer, and the optimum bonding time (keeping the bonding temperature constant as 1030 °C) was determined based on microstructural examinations by optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS), tensile testing, and nano-hardness measurements. TLP bonding at 1030 °C for 90 min resulted in isothermal solidification, hence obtained joints free from eutectic phases. All of the tensile-tested samples failed within the copper alloy and away from their joints. The hardness distribution across the bond zone was also studied.

Microstructure and Mechanical Properties of Diffusion-Bonded CoCrNi-Based Medium-Entropy Alloy to DD5 Single-Crystal Superalloy Joint

This study focuses on the diffusion bonding of a CoCrNi-based medium-entropy alloy (MEA) to a DD5 single-crystal superalloy. The microstructure and mechanical properties of the joint diffusion-bonded at variable bonding temperatures were investigated. The formation of diffusion zone, mainly composed of the Ni3(Al, Ti)-type γ′ precipitates and Ni-rich MEA matrix, effectively guaranteed the reliable joining of MEA and DD5 substrates. As the bonding temperature increased, so did the width of the diffusion zone, and the interfacial microvoids significantly closed, representing the enhancement of interface bonding. Both tensile strength and elongation of the joint diffusion-bonded at 1110 °C were superior to those of the joints diffusion-bonded at low temperatures (1020, 1050, and 1080 °C), and the maximum tensile strength and elongation of 1045 MPa and 22.7% were obtained. However, elevated temperature produced an adverse effect that appeared as grain coarsening of the MEA substrate. The ductile fracture of the joint occurred in the MEA substrate (1110 °C), whereas the tensile strength was lower than that of the MEA before diffusion bonding (approximately 1.3 GPa).

Weldability and machinability of the dissimilar joints of Ti alloy and stainless steel – A review

As two important industrial manufacturing materials, titanium alloys and stainless steel have their own advantages and disadvantages in terms of physical, chemical, and mechanical properties. The field of materials manufacturing has witnessed efforts to develop technical processes that can properly combine these two alloy types, aiming to effectively use their respective advantages. The welding technology for Ti alloy and stainless steel, as a research topic with broad prospects, is comprehensively and deeply analyzed in this review. The current research progress in this field was analyzed from different process perspectives such as fusion welding, brazing, diffusion welding, friction welding, explosive welding and vacuum hot-rolling welding. The results of the review showed that the greatest challenges of fusion welding are low ductility of the material, high residual stress, high cooling rate, and the formation of numerous brittle Ti-Fe intermetallics. By using appropriate intermediate materials between these two materials, the residual stress and brittle intermetallics near the interface of the transition joint can be minimised by solving the thermal expansion mismatch, reducing the bonding temperature and pressure, and suppressing the diffusion of elements such as Ti and Fe.

Phase Formation during Heating of Amorphous Nickel-Based BNi-3 for Joining of Dissimilar Cobalt-Based Superalloys

Phase transformations and the melting range of the interlayer BNi-3 were investigated by differential scanning calorimetry, which showed three stages of crystallization during heating. There were three exothermic peaks that indicated crystallization in the solid state. The cobalt-based X-45 and FSX-414 superalloys were bonded with interlayer BNi-3 at a constant holding time of 10 min with bonding temperatures of 1010, 1050, 1100, and 1150 °C using a vacuum diffusion brazing process. Examination of microstructural changes in the base metals with light microscopy and scanning electron microscopy coupled with X-ray spectroscopy based on the energy distribution showed that increasing temperature caused a solidification mode, such that the bonding centerline at 1010 °C/10 min included a γ-solid solution, Ni3B, Ni6Si2B, and Ni3Si. The athermally solidified zone of the transient liquid phase (TLP)-bonded sample at 1050 °C/10 min involved a γ-solid solution, Ni3B, CrB, Ni6Si2B, and Ni3Si. Finally, isothermal solidification was completed within 10 min at 1150 °C. The diffusion-affected zones on both sides had three distinct zones: a coarse block precipitation zone, a fine and needle-like mixed-precipitation zone, and a needle-like precipitation zone. By increasing the bonding temperature, the diffusion-affected zone became wider and led to dissolution.

Effect of various parameters on the shear strength of solid-state nanoporous Cu bonding in Cu–Cu disks for power device packaging

Nanoparticle sintering is considered a promising alternative bonding method to Pb- based soldering for the attachment of components in high-temperature electronic devices. However, the technology still poses certain challenges, such as difficulty controlling joint thickness and the generation of voids owing to solvent evaporation. In this study, a solid-state (solvent-free), nanoporous-Cu (NPC) bonding method was examined. The effect of bonding temperatures (200–400°C) and atmospheres (N2 or formic acid) on the shear strength of joints formed between NPC sheets and bare Cu disks were investigated by scanning electron microscopy, X-ray diffraction, and transmission electron microscopy. It was shown that the bondability of NPC under an N2 atmosphere is closely related to the oxide layer formed on its surface that impairs the diffusion of Cu atoms between the NPC and Cu substrate. Furthermore, the coarsening of the NPC microstructure under a formic acid atmosphere at ≥ 350°C owing to the rapid diffusion of Cu atoms and accompanying plastic deformation induced by surface stress enhances the shear strength of the resulting NPC/Cu joint. The shear strength of NPC/Cu joints formed under a formic acid atmosphere increased from 14.1 to 35.9 MPa with increasing bonding temperature. Based on the results of the investigation, a mechanism was proposed to explain the superiority of the Cu–Cu joints achieved using this method.