Root-cause analysis of process-data quality problems

2021 ◽  
pp. 1-25
Author(s):  
Robert Andrews ◽  
Fahame Emamjome ◽  
Arthur H.M. ter Hofstede ◽  
Hajo A. Reijers
Keyword(s):  
Data Quality ◽  
Root Cause Analysis ◽  
Process Data ◽  
Cause Analysis ◽  
Root Cause

scholarly journals AUTOMATED ROOT CAUSE ANALYSIS OF NON-CONFORMITIES WITH MACHINE LEARNING ALGORITHMS

2018 ◽  
Vol 18 (4) ◽  
pp. 60-72 ◽  
Author(s):  
Tobias MUELLER ◽  
Jonathan GREIPEL ◽  
Tobias WEBER ◽  
Robert H. SCHMITT
Keyword(s):  
Machine Learning ◽  
Expert Knowledge ◽  
Learning Algorithms ◽  
Root Cause Analysis ◽  
Machine Learning Algorithms ◽  
Decision Tree Algorithm ◽  
Process Data ◽  
Cause Analysis ◽  
Root Cause ◽  
High Level

To detect root causes of non-conforming parts - parts outside the tolerance limits - in production processes a high level of expert knowledge is necessary. This results in high costs and a low flexibility in the choice of personnel to perform analyses. In modern production a vast amount of process data is available and machine learning algorithms exist which model processes empirically. Aim of this paper is to introduce a procedure for an automated root cause analysis based on machine learning algorithms to reduce the costs and the necessary expert knowledge. Therefore, a decision tree algorithm is chosen. A procedure for its application in an automated root cause analysis is presented and simulations to prove its applicability are conducted. In this paper influences affecting the success of detection are identified and simulated e.g. the necessary amount of data dependent on the amount of variables, the ratio between categories of non-conformities and OK parts as well as detectable root causes. The simulations are based on a regression model to determine the roughness of drilling holes. They prove the applicability of machine learning algorithms for an automated root cause analysis and indicate which influences have to be considered in real scenarios.

Root Cause analysis of SG tube ODSCC indications within the tube sheets of NPP biblis unit A

2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Rule Construction and its Execution for Root Cause Analysis

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Root Cause Analysis Techniques Using Picosecond Time Resolved LADA

2014 ◽  
Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Picosecond Laser ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
Time Resolved ◽  
Cause Analysis ◽  
Root Cause ◽  
Design And Manufacturing ◽  
Multiple Interactions ◽  
Established Technique

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

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