Fabrication and performance of bottom-emitting flip-chip bonded 980 nm vertical-cavity lasers with copper- and indium-plated heat-sinks

2011 ◽  
Vol 26 (12) ◽  
pp. 125020 ◽  
Author(s):  
A N Al-Omari ◽  
K L Lear
1995 ◽  
Vol 7 (11) ◽  
pp. 1237-1239 ◽  
Author(s):  
K.D. Choquette ◽  
K.L. Lear ◽  
R.P. Schneider ◽  
K.M. Geib ◽  
J.J. Figiel ◽  
...  

1999 ◽  
Vol 11 (3) ◽  
pp. 304-306 ◽  
Author(s):  
D.A. Louderback ◽  
O. Sjolund ◽  
E.R. Hegblom ◽  
J. Ko ◽  
L.A. Coldren

1991 ◽  
Author(s):  
Jack L. Jewell ◽  
Yong H. Lee ◽  
Samuel L. McCall ◽  
Axel Scherer ◽  
James P. Harbison ◽  
...  

1997 ◽  
Vol 56 (1) ◽  
pp. 845-853 ◽  
Author(s):  
M. P. van Exter ◽  
A. K. Jansen van Doorn ◽  
J. P. Woerdman

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