Fabrication and performance of bottom-emitting flip-chip bonded 980 nm vertical-cavity lasers with copper- and indium-plated heat-sinks
2011 ◽
Vol 26
(12)
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pp. 125020
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Keyword(s):
1995 ◽
Vol 7
(11)
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pp. 1237-1239
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2002 ◽
Vol 8
(4)
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pp. 943-947
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Keyword(s):
Keyword(s):
1999 ◽
Keyword(s):
1999 ◽
Vol 11
(3)
◽
pp. 304-306
◽
Keyword(s):
Keyword(s):
1994 ◽