1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)
Latest Publications

TOTAL DOCUMENTS

217

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780352319

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Post-weld-shift in semiconductor laser packaging

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) ◽

10.1109/ectc.1999.776341 ◽

2005 ◽

Cited By ~ 7

Author(s):

S.C. Wang ◽

H.L. Chang ◽

C. Wang ◽

C.M. Wang ◽

J.W. Liaw ◽

...

Keyword(s):

Semiconductor Laser

Oxide adhesion characteristic of lead frame copper alloys

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) ◽

10.1109/ectc.1999.776258 ◽

2005 ◽

Cited By ~ 1

Author(s):

Y. Tomioka ◽

J. Miyake

Keyword(s):

Copper Alloys ◽

Lead Frame ◽

Adhesion Characteristic ◽

Oxide Adhesion

Early footprint comparison for area I/0 packages and first level interconnect

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) ◽

10.1109/ectc.1999.776380 ◽

2005 ◽

Author(s):

E. Hirt ◽

G. Troster

A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) ◽

10.1109/ectc.1999.776255 ◽

2003 ◽

Cited By ~ 11

Author(s):

A.A.O. Tay ◽

K.Y. Goh

Keyword(s):

Delamination Growth ◽

Die Attach ◽

Solder Reflow

Properties and reliability of Ta/sub 2/O/sub 5/ thin films deposited on Ta

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) ◽

10.1109/ectc.1999.776315 ◽

2003 ◽

Author(s):

S. Ezhilvalavan ◽

Tseung-Yuen Tseng

Keyword(s):

Thin Films

Delamination from process induced sources

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) ◽

10.1109/ectc.1999.776276 ◽

2003 ◽

Cited By ~ 6

Author(s):

A.T. Cheung

Development of BGA solder joint vibration fatigue life prediction model

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) ◽

10.1109/ectc.1999.776163 ◽

2003 ◽

Cited By ~ 22

Author(s):

T.E. Wong ◽

B.A. Reed ◽

H.M. Cohen ◽

D.W. Chu

Keyword(s):

Fatigue Life ◽

Solder Joint ◽

Prediction Model ◽

Life Prediction ◽

Fatigue Life Prediction ◽

Vibration Fatigue ◽

Joint Vibration ◽

Life Prediction Model

Conductive adhesives with stable contact resistance and superior impact performance

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) ◽

10.1109/ectc.1999.776196 ◽

2003 ◽

Cited By ~ 26

Author(s):

Q.K. Tong ◽

D.L. Markley ◽

G. Frederickson ◽

R. Kuder ◽

Daoqiang Lu

Keyword(s):

Contact Resistance ◽

Conductive Adhesives ◽

Impact Performance

Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) ◽

10.1109/ectc.1999.776307 ◽

2003 ◽

Cited By ~ 9

Author(s):

X.J. Fan ◽

H.B. Wang ◽

T.B. Lim

Keyword(s):

Cyclic Loading ◽

Flip Chip

Flux free flip chip attach technology for BGA/CSP packages

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) ◽

10.1109/ectc.1999.776206 ◽

2003 ◽

Author(s):

M. Furuno ◽

T. Masuda ◽

K. Doi ◽

H. Nomura

Keyword(s):

Flip Chip

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Post-weld-shift in semiconductor laser packaging

Oxide adhesion characteristic of lead frame copper alloys

Early footprint comparison for area I/0 packages and first level interconnect

A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow

Properties and reliability of Ta/sub 2/O/sub 5/ thin films deposited on Ta

Delamination from process induced sources

Development of BGA solder joint vibration fatigue life prediction model

Conductive adhesives with stable contact resistance and superior impact performance

Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

Flux free flip chip attach technology for BGA/CSP packages

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)
Latest Publications