scholarly journals Root cause analysis of newsprint waste using pareto analysis and cause and effect matrix

2020 ◽  
Vol 810 ◽  
pp. 012072 ◽  
Author(s):  
Jatin H Varma ◽  
Sachin Lal
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Pareto Analysis ◽  
Cause And Effect ◽  
Root Cause

scholarly journals Kajian Metode Root Cause Analysis yang Digunakan dalam Manajemen Risiko di Industri Farmasi

2021 ◽  
Vol 6 (4) ◽  
pp. 310
Author(s):  
Nurike Susendi ◽  
Adrian Suparman ◽  
Iyan Sopyan
Keyword(s):  
Failure Mode ◽  
Drug Administration ◽  
Six Sigma ◽  
Quality By Design ◽  
Root Cause Analysis ◽  
Effect Analysis ◽  
Cause Analysis ◽  
Pareto Analysis ◽  
Root Cause ◽  
Fishbone Diagram

Untuk meningkatkan pengembangan produk, efisiensi proses produksi dan strategi pengendalian, Food and Drug Administration (FDA) mendorong penerapan Quality by Design (QBD) sebagai pendekatan ilmiah yang berbasis pada penerapan mutu risiko dalam pengembangan produk obat. Manajemen risiko bertujuan untuk menganalisis sebuah sistem terhadap potensi penyimpangan  yang terjadi untuk mencegah masalah yang lebih serius. Artikel ini bertujuan untuk memberikan pengetahuan mengenai metode root cause analysis yang dapat digunakan dalam manajemen risiko mutu terhadap masalah yang terjadi di industri farmasi. Dalam mereview artikel ini jurnal yang didapat dari berbagai sumber secara daring melalui berbagai jurnal nasional dan internasional yang diakses dari situs Google scholar, Elsevier dan PubMed. Hasil dari review artikel metode analisis akar penyebab, seperti Pareto Analysis, Fishbone Diagram, 5Whys, Failure Mode and Effect Analysis, Brainstorming dan Six Sigma, dapat digunakan untuk menemukan akar penyebab suatu masalah dengan perbedaan masing-masing metode dari segi tahapan, analisis dan penilaian risiko. Dari review yang dibuat, dapat disimpulkan bahwa keenam metode root cause analysis yang diketahui memiliki perbedaan serta kelebihan dan kekurangan masing-masing metode, sehingga dalam penggunaannya dapat disesuaikan dengan kebutuhan suatu masalah yang terjadi di industri  farmasi melalui kriteria kelebihan dan kekurangan metode tersebut.   

Root Cause analysis of SG tube ODSCC indications within the tube sheets of NPP biblis unit A

2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Rule Construction and its Execution for Root Cause Analysis

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Root Cause Analysis Techniques Using Picosecond Time Resolved LADA

2014 ◽  
Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Picosecond Laser ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
Time Resolved ◽  
Cause Analysis ◽  
Root Cause ◽  
Design And Manufacturing ◽  
Multiple Interactions ◽  
Established Technique

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

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