A fast eigenvalue-based solution for full-wave analysis of large-scale three-dimensional on-chip interconnect structures

2007 IEEE Antennas and Propagation Society International Symposium ◽

10.1109/aps.2007.4396300 ◽

2007 ◽

Author(s):

Jianfang Zhu ◽

Dan Jiao

Keyword(s):

Large Scale ◽

Three Dimensional ◽

Wave Analysis ◽

Full Wave ◽

Full Wave Analysis ◽

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A Linear-Time Complex-Valued Eigenvalue Solver for Full-Wave Analysis of Large-Scale On-Chip Interconnect Structures

IEEE Transactions on Microwave Theory and Techniques ◽

10.1109/tmtt.2009.2025457 ◽

2009 ◽

Vol 57 (8) ◽

pp. 2021-2029 ◽

Author(s):

Jongwon Lee ◽

V. Balakrishnan ◽

Cheng-Kok Koh ◽

Dan Jiao

Keyword(s):

Large Scale ◽

Linear Time ◽

Wave Analysis ◽

Full Wave ◽

Full Wave Analysis ◽

On Chip ◽

Complex Valued ◽

Eigenvalue Solver

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Fast full-wave analysis of large-scale three-dimensional photonic crystal devices

Journal of the Optical Society of America B ◽

10.1364/josab.24.002406 ◽

2007 ◽

Vol 24 (9) ◽

pp. 2406 ◽

Author(s):

Yu-Jia Li ◽

Jian-Ming Jin

Keyword(s):

Photonic Crystal ◽

Large Scale ◽

Three Dimensional ◽

Wave Analysis ◽

Dimensional Photonic Crystal ◽

Full Wave ◽

Full Wave Analysis

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A unified finite-element solution from zero frequency to microwave frequencies for full-wave modeling of large-scale three-dimensional on-chip interconnect structures

2008 IEEE Antennas and Propagation Society International Symposium ◽

10.1109/aps.2008.4618921 ◽

2008 ◽

Author(s):

Jianfang Zhu ◽

Dan Jiao

Keyword(s):

Finite Element ◽

Large Scale ◽

Three Dimensional ◽

Finite Element Solution ◽

Element Solution ◽

Wave Modeling ◽

Microwave Frequencies ◽

Full Wave ◽

On Chip ◽

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Full-Wave Analysis of Large-Scale Interconnects Using the Multilevel UV Method With the Sparse Matrix Iterative Approach (SMIA)

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2008.2005021 ◽

2008 ◽

Vol 31 (4) ◽

pp. 818-829 ◽

Author(s):

Chong-Jin Ong ◽

Leung Tsang

Keyword(s):

Large Scale ◽

Sparse Matrix ◽

Iterative Approach ◽

Wave Analysis ◽

Full Wave ◽

Full Wave Analysis

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Efficient Method for Full-Wave Analysis of Large-Scale Finite-Sized Periodic Structures

Journal of Electromagnetic Waves and Applications ◽

10.1163/156939307783152812 ◽

2007 ◽

Vol 21 (14) ◽

pp. 2157-2168 ◽

Author(s):

W. B. Lu ◽

T. J. Cui

Keyword(s):

Efficient Method ◽

Large Scale ◽

Periodic Structures ◽

Wave Analysis ◽

Full Wave ◽

Full Wave Analysis

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Full-wave analysis of three-dimensional electric field distributions in periodic coplanar waveguides

Proceedings of 1997 Asia-Pacific Microwave Conference ◽

10.1109/apmc.1997.654617 ◽

2002 ◽

Author(s):

T.Q. Deng ◽

M.S. Leong ◽

P.S. Kooi ◽

T.S. Yeo

Keyword(s):

Electric Field ◽

Three Dimensional ◽

Coplanar Waveguides ◽

Wave Analysis ◽

Full Wave ◽

Field Distributions ◽

Full Wave Analysis

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Full-wave analysis of three-dimensional planar structures

IEEE Transactions on Microwave Theory and Techniques ◽

10.1109/22.273428 ◽

1993 ◽

Vol 41 (11) ◽

pp. 2002-2015 ◽

Author(s):

A.M. Lerer ◽

A.G. Schuchinsky

Keyword(s):

Three Dimensional ◽

Wave Analysis ◽

Full Wave ◽

Planar Structures ◽

Full Wave Analysis

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Full-wave analysis of three-dimensional optical metamaterials involving deformed nanowires

2015 9th International Congress on Advanced Electromagnetic Materials in Microwaves and Optics (METAMATERIALS) ◽

10.1109/metamaterials.2015.7342549 ◽

2015 ◽

Author(s):

B. Karaosmanoglu ◽

A. Yilmaz ◽

O. Ergul

Keyword(s):

Three Dimensional ◽

Wave Analysis ◽

Optical Metamaterials ◽

Full Wave ◽

Full Wave Analysis

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Full-wave analysis of three-dimensional microstrip discontinuities by a new spectral domain approach

Proceedings of IEEE Antennas and Propagation Society International Symposium and URSI National Radio Science Meeting ◽

10.1109/aps.1994.408124 ◽

2002 ◽

Author(s):

H. Aroudaki ◽

V. Hansen

Keyword(s):

Three Dimensional ◽

Spectral Domain ◽

Wave Analysis ◽

Full Wave ◽

Spectral Domain Approach ◽

Full Wave Analysis ◽

Microstrip Discontinuities

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A Unified Finite-Element Solution From Zero Frequency to Microwave Frequencies for Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2008.924232 ◽

2008 ◽

Vol 31 (4) ◽

pp. 873-881 ◽

Author(s):

Jianfang Zhu ◽

Dan Jiao

Keyword(s):

Finite Element ◽

Large Scale ◽

Three Dimensional ◽

Finite Element Solution ◽

Element Solution ◽

Wave Modeling ◽

Microwave Frequencies ◽

Full Wave ◽

On Chip ◽

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