An efficient algorithm of compressing decimal notations for tree structures

Author(s):  
J. Aoe
Author(s):  
P.J. Phillips ◽  
J. Huang ◽  
S. M. Dunn

In this paper we present an efficient algorithm for automatically finding the correspondence between pairs of stereo micrographs, the key step in forming a stereo image. The computation burden in this problem is solving for the optimal mapping and transformation between the two micrographs. In this paper, we present a sieve algorithm for efficiently estimating the transformation and correspondence.In a sieve algorithm, a sequence of stages gradually reduce the number of transformations and correspondences that need to be examined, i.e., the analogy of sieving through the set of mappings with gradually finer meshes until the answer is found. The set of sieves is derived from an image model, here a planar graph that encodes the spatial organization of the features. In the sieve algorithm, the graph represents the spatial arrangement of objects in the image. The algorithm for finding the correspondence restricts its attention to the graph, with the correspondence being found by a combination of graph matchings, point set matching and geometric invariants.


2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.


2016 ◽  
Vol 2016 (7) ◽  
pp. 1-6
Author(s):  
Sergey Makov ◽  
Vladimir Frantc ◽  
Viacheslav Voronin ◽  
Igor Shrayfel ◽  
Vadim Dubovskov ◽  
...  

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