Multi-domain analysis of PBGA solder joints for structural design optimization

2002 ◽  
Author(s):  
M. Rassaian ◽  
W. Chang ◽  
Jung-Chan Lee
Keyword(s):  
Design Optimization ◽  
Structural Design ◽  
Solder Joints ◽  
Domain Analysis ◽  
Structural Design Optimization

Structural design optimization for board-level drop reliability of wafer-level chip-scale packages

2008 ◽  
Vol 48 (5) ◽  
pp. 757-762 ◽  
Author(s):  
Tsung-Yueh Tsai ◽  
Yi-Shao Lai ◽  
Chang-Lin Yeh ◽  
Rong-Sheng Chen
Keyword(s):  
Design Optimization ◽  
Structural Design ◽  
Wafer Level ◽  
Structural Design Optimization ◽  
Board Level
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