1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)
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Packaging education for the 21st century

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) ◽

10.1109/ectc.1998.678747 ◽

2002 ◽

Author(s):

J. Schutt-Aine ◽

A. Cangellaris ◽

E. Michielssen

Keyword(s):

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Electromagnetic analysis of high-density multi-chip module substrates having semi-custom interconnects

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) ◽

10.1109/ectc.1998.678923 ◽

2002 ◽

Author(s):

B. Beker ◽

I. Yee ◽

R. Miracky

Keyword(s):

High Density ◽

Electromagnetic Analysis

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Multi-domain analysis of PBGA solder joints for structural design optimization

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) ◽

10.1109/ectc.1998.678917 ◽

2002 ◽

Author(s):

M. Rassaian ◽

W. Chang ◽

Jung-Chan Lee

Keyword(s):

Design Optimization ◽

Structural Design ◽

Solder Joints ◽

Domain Analysis ◽

Structural Design Optimization

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Reliability studies of plastic ball grid array assemblies reflowed in nitrogen ambient

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) ◽

10.1109/ectc.1998.678708 ◽

2002 ◽

Author(s):

Y.P. Wu ◽

Y.C. Chan ◽

J.K.L. Lai

Keyword(s):

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array

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Electrical characterization of multilayered thin film integral passive devices

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) ◽

10.1109/ectc.1998.678700 ◽

2002 ◽

Author(s):

G. Morcan ◽

T. Lenihan ◽

J.P. Parkerson ◽

L. Schaper ◽

S. Ang

Keyword(s):

Thin Film ◽

Electrical Characterization ◽

Multilayered Thin Film ◽

Passive Devices

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Thermal simulation and validation of the fast static RAM 164-lead FC-PBGA package with investigations of package thermal performance in a generic CPU module

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) ◽

10.1109/ectc.1998.678672 ◽

2002 ◽

Author(s):

M. Eyman ◽

Z. Johnson ◽

B. Joiner

Keyword(s):

Thermal Performance ◽

Thermal Simulation ◽

Simulation And Validation

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Flip chip equipment for high end electro-optical modules

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) ◽

10.1109/ectc.1998.678689 ◽

2002 ◽

Author(s):

K.A. Cooper ◽

R. Yang ◽

J.S. Mottet ◽

G. Lecarpentier

Keyword(s):

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Polymer interfacial adhesion in microelectronic assemblies

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) ◽

10.1109/ectc.1998.678682 ◽

2002 ◽

Author(s):

X. Dai ◽

M.V. Brillhart ◽

P.S. Ho

Keyword(s):

Interfacial Adhesion

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High temperature joints manufactured at low temperature

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) ◽

10.1109/ectc.1998.678707 ◽

2002 ◽

Author(s):

W.W. So ◽

C.C. Lee

Keyword(s):

High Temperature ◽

Low Temperature

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Characterization of a no-flow underfill encapsulant during the solder reflow process

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) ◽

10.1109/ectc.1998.678898 ◽

2002 ◽

Author(s):

C.P. Wong ◽

D. Baldwin ◽

M.B. Vincent ◽

B. Fennell ◽

L.J. Wang ◽

...

Keyword(s):

Reflow Process ◽

Solder Reflow ◽

Underfill Encapsulant

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