Characterization of Chip-to-Package Interconnects for Glass Panel Embedding (GPE) for Sub-THz Wireless Communications

Author(s):  
Serhat Erdogan ◽  
Siddharth Ravichandran ◽  
Xiaofan Jia ◽  
Madhavan Swaminathan
2007 ◽  
Vol 6 ◽  
pp. 36-39 ◽  
Author(s):  
Leilei Liu ◽  
Wei Hong ◽  
Haiming Wang ◽  
Guangqi Yang ◽  
Nianzu Zhang ◽  
...  

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