Experimental investigation of noise immunity diagnosis for printed circuit boards by bulk current injection test

Noise Immunity ◽

Printed Circuit Boards ◽

Current Injection ◽

Circuit Boards ◽

Injection Test ◽

Numerical and Experimental Investigation of Power Supply Noise Decoupling Strategies on Single-Sided Printed Circuit Boards

2007 IEEE International Symposium on Electromagnetic Compatibility ◽

10.1109/isemc.2007.166 ◽

2007 ◽

Cited By ~ 3

Author(s):

Cyrous Rostamzadeh ◽

S. Connor ◽

Bruce Archambeault

Keyword(s):

Power Supply ◽

Printed Circuit Boards ◽

Power Supply Noise ◽

Circuit Boards ◽

Printed Circuit ◽

Supply Noise

Experimental Investigation of Pyrolysis of Printed Circuit Boards for Energy and Materials Recovery under Nitrogen and Steam Atmosphere

Energy Procedia ◽

10.1016/j.egypro.2017.03.435 ◽

2017 ◽

Vol 105 ◽

pp. 986-991 ◽

Cited By ~ 8

Author(s):

Panagiotis Evangelopoulos ◽

Efthymios Kantarelis ◽

Weihong Yang

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit ◽

Materials Recovery

Noise immunity design for multilayer printed circuit boards using electromagnetic simulation

2015 IEEE International Symposium on Electromagnetic Compatibility (EMC) ◽

10.1109/isemc.2015.7256302 ◽

2015 ◽

Author(s):

Mamoru Kamikura ◽

Norihiko Akashi ◽

Yuichiro Murata

Keyword(s):

Noise Immunity ◽

Printed Circuit Boards ◽

Electromagnetic Simulation ◽

Circuit Boards ◽

2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) ◽

Numerical and experimental investigation of noise coupling perturbed by ESD currents on printed circuit boards

10.1109/isemc.2003.1236561 ◽

2004 ◽

Cited By ~ 2

Author(s):

Yi-Shang Huang ◽

Tzong-Lin Wu

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit ◽

Noise Coupling

Experimental investigation of the influence of reaction atmosphere on the pyrolysis of printed circuit boards

Applied Energy ◽

10.1016/j.apenergy.2017.04.087 ◽

2017 ◽

Vol 204 ◽

pp. 1065-1073 ◽

Cited By ~ 16

Author(s):

Panagiotis Evangelopoulos ◽

Efthymios Kantarelis ◽

Weihong Yang

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit ◽

Reaction Atmosphere

Numerical and experimental investigation on heat transfer of multi-heat sources mounted on an array of printed circuit boards in a rectangular case

Applied Thermal Engineering ◽

10.1016/j.applthermaleng.2019.04.032 ◽

2019 ◽

Vol 156 ◽

pp. 156-167 ◽

Cited By ~ 1

Author(s):

Warakorn Thepsut ◽

Naris Pratinthong

Keyword(s):

Heat Transfer ◽

Printed Circuit Boards ◽

Heat Sources ◽

Circuit Boards ◽

Experimental investigation on the heat transfer characteristics in process of printed circuit boards pyrolysis under nitrogen flow

The Science of The Total Environment ◽

10.1016/j.scitotenv.2018.04.365 ◽

2018 ◽

Vol 636 ◽

pp. 1032-1039 ◽

Cited By ~ 3

Author(s):

Na Du ◽

Hongting Ma ◽

Xueyin Lin ◽

Jingyu Zhang ◽

Chaofan Liu

Keyword(s):

Heat Transfer ◽

Printed Circuit Boards ◽

Nitrogen Flow ◽

Circuit Boards ◽

Heat Transfer Characteristics ◽

Printed Circuit ◽

Transfer Characteristics

Space Dependence of Divided Ground Patterns on FM-Band Cross-Talk Characteristics between Two Parallel Signal Traces on Printed Circuit Boards for Vehicles

IEEJ Transactions on Electronics Information and Systems ◽

10.1541/ieejeiss.132.1897 ◽

2012 ◽

Vol 132 (12) ◽

pp. 1897-1903 ◽

Cited By ~ 2

Author(s):

Michihira Iida ◽

Tsuyoshi Maeno ◽

Jianqing Wang ◽

Osamu Fujiwara

Keyword(s):

Cross Talk ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit ◽

Space Dependence

An Evaluation Method on Effect of Geometrical Configuration to FM-Band Cross-Talk Characteristics between Two Parallel Signal Traces including their Divided Ground Patterns on Printed Circuit Boards for Vehicles

IEEJ Transactions on Fundamentals and Materials ◽

10.1541/ieejfms.135.9 ◽

2015 ◽

Vol 135 (1) ◽

pp. 9-16

Author(s):

Michihira Iida ◽

Tsuyoshi Maeno ◽

Jianqing Wang ◽

Osamu Fujiwara

Keyword(s):

Cross Talk ◽

Printed Circuit Boards ◽

Evaluation Method ◽

Geometrical Configuration ◽

Circuit Boards ◽

Effect of Water Absorption Temperature on Space Charge Profiles in Paper/phenol-resin Composites for Printed Circuit Boards

IEEJ Transactions on Fundamentals and Materials ◽

10.1541/ieejfms.128.585 ◽

2008 ◽

Vol 128 (9) ◽

pp. 585-590 ◽

Cited By ~ 5

Author(s):

Yasutsune Echigo ◽

Masashi Natsui ◽

Takashi Maeno ◽

Yoshimichi Ohki

Keyword(s):

Space Charge ◽

Water Absorption ◽

Printed Circuit Boards ◽

Resin Composites ◽

Circuit Boards ◽

Phenol Resin ◽

Printed Circuit ◽

Effect Of Water