Electronics improvements for low-level control in the humanoid robot TEO

This work began with developing the first electronic integration to allow the operation of commercial TEO devices pre-selected. However, different problems were discovered during the implementation of the whole set. These were caused by the malfunction of the system and the particular design. For this reason, this paper is focused on the analysis of the first hardware architecture to propose and develop a solution that improves the performance of the joint motor control.Significantly, the detected problems are voltage drops in the power supply signals of some devices, electrical noise coupling or overshoots produced by the switching of the power inverter of the driver, and the electromechanical disconnections of various signals caused by the relative motion between devices. The consequence was that the robot joints control was not robust, preventing them from moving accurately. After the analysis, new interconnection electronics was developed. This electronic has been designed to be more integrated with the mechanic parts, improving subsystems location, and integrating new solutions to reduce the electrical problems. The new electronics have been tested in the humanoid robot arms with good results.

Visibility of noisy quantum dot-based measurements of Majorana qubits

Measurement schemes of Majorana zero modes (MZMs) based on quantum dots (QDs) are of current interest as they provide a scalable platform for topological quantum computation. In a coupled qubit-QD setup we calculate the dependence of the charge of the QD and its differential capacitance on experimentally tunable parameters for both 2-MZM and 4-MZM measurements. We quantify the effect of noise on the measurement visibility by considering 1/f noise in detuning, tunneling amplitudes or phase. We find that on- or close-to-resonance measurements are generally preferable and predict, using conservative noise estimates, that noise coupling to the QDs is not a limitation to high-fidelity measurements of topological qubits.

Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling

In this paper, two intelligent methods which are GAs and PSO are used to model noise coupling in a Three-Dimensional Integrated Circuit (3D-IC) based on TSVs. These techniques are rarely used in this type of structure. They allow computing all the elements of the noise model, which helps to estimate the noise transfer function in the frequency and time domain in 3D complicated systems. Noise models include TSVs, active circuits, and substrate, which make them difficult to model and to estimate. Indeed, the proposed approaches based on GA and PSO are robust and powerful. To validate the method, comparisons among the results found by GA, PSO, measurements, and the 3D-TLM method, which presents an analytical technique, are made. According to the obtained simulation and experimental results, it is found that the proposed methods are valid, efficient, precise, and robust.

Polysilicon devices as a highly compatible ESD protection with modulable voltage and low capacitance

The electronic circuits fabricated in a variety of technologies for different applications are all vulnerable to the electrostatic discharge (ESD) event. In this paper, polysilicon devices are investigated as ESD protection because of the noticeable advantages such as compatibility with several technologies, low parasitical capacitance, and little noise coupling. By forming the p-i-n diode in the polysilicon layer and stacking them together, the single polysilicon diode (SPD) and cascaded polysilicon diode (CasPD) are implemented in the 0.35 [Formula: see text] high voltage diffusion process. Through DC IV/CV, transmission line pulse (TLP), and zipping test, the CasPD presents as ESD protection for an S-band RF power amplifier, with high process-compatibility, modulable voltage, low leakage current and parasitic capacitance.