An efficient signature loading mechanism for memory repair

Proceedings of IEEE East-West Design & Test Symposium (EWDTS 2014) ◽

10.1109/ewdts.2014.7027061 ◽

2014 ◽

Author(s):

Vrezh Sargsyan

Keyword(s):

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Memory repair logic sharing techniques and their impact on yield

2020 IEEE International Test Conference (ITC) ◽

10.1109/itc44778.2020.9325280 ◽

2020 ◽

Author(s):

Benoit Nadeau-Dostie ◽

Luc Romain

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RelaxFault memory repair

ACM SIGARCH Computer Architecture News ◽

10.1145/3007787.3001205 ◽

2016 ◽

Vol 44 (3) ◽

pp. 645-657

Author(s):

Dong Wan Kim ◽

Mattan Erez

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Reactivation of Spares for Off-Chip Memory Repair After Die Stacking in a 3-D IC With TSVs

IEEE Transactions on Circuits and Systems I Regular Papers ◽

10.1109/tcsi.2013.2246235 ◽

2013 ◽

Vol 60 (9) ◽

pp. 2343-2351 ◽

Author(s):

Yung-Fa Chou ◽

Ding-Ming Kwai ◽

Ming-Der Shieh ◽

Cheng-Wen Wu

Keyword(s):

Die Stacking ◽

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A fault-tolerant associative approach to on-line memory repair

IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems DFTVS-94 ◽

10.1109/dftvs.1994.630027 ◽

2002 ◽

Author(s):

Jien-Chung Lo

Keyword(s):

Fault Tolerant ◽

On Line ◽

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High Performance Memory Repair

2019 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT) ◽

10.1109/dft.2019.8875490 ◽

2019 ◽

Author(s):

Feroze Merchant ◽

Anandraj Devarajan ◽

Anik Basu ◽

Dave Ashen ◽

Brandon Yelton ◽

...

Keyword(s):

High Performance ◽

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The Challenge of Localism and Memory Repair

Memories of Tiananmen ◽

10.2307/j.ctv1rr6dk9.10 ◽

2021 ◽

pp. 187-222

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RelaxFault Memory Repair

2016 ACM/IEEE 43rd Annual International Symposium on Computer Architecture (ISCA) ◽

10.1109/isca.2016.62 ◽

2016 ◽

Author(s):

Dong Wan Kim ◽

Mattan Erez

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Is TSV-based 3D Integration Suitable for Inter-die Memory Repair?

Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013 ◽

10.7873/date.2013.259 ◽

2013 ◽

Author(s):

Mihai Lefter ◽

George R. Voicu ◽

Mottaqiallah Taouil ◽

Marius Enachescu ◽

Said Hamdioui ◽

...

Keyword(s):

3D Integration ◽

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W-ERA: One-Time Memory Repair with Wafer-Level Early Repair Analysis for Cost Reduction

2020 IEEE International Test Conference in Asia (ITC-Asia) ◽

10.1109/itc-asia51099.2020.00028 ◽

2020 ◽

Author(s):

Hayoung Lee ◽

Donghyun Han ◽

Hogyeong Kim ◽

Sungho Kang

Keyword(s):

Cost Reduction ◽

Wafer Level ◽

Early Repair ◽

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Iterative Diagnosis Approach for ECC-Based Memory Repair

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems ◽

10.1109/tcad.2018.2887052 ◽

2020 ◽

Vol 39 (2) ◽

pp. 464-477

Author(s):

Panagiota Papavramidou ◽

Michael Nicolaidis

Keyword(s):

Diagnosis Approach ◽

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