The study on information extraction of BGA solders joint 2-D morphology based on wavelet modulus maximum
2004 ◽
Vol 59
(17)
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pp. 3569-3575
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2011 ◽
Vol 130-134
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pp. 2160-2165
2014 ◽
Vol 27
(7)
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pp. 683-688
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Keyword(s):
2015 ◽
Vol 114
◽
pp. 259-262
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Keyword(s):
2018 ◽
Vol 2018
(46)
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pp. 38-42