2011 12th International Conference on Electronic Packaging Technology and High Density Packaging
Latest Publications

TOTAL DOCUMENTS

263

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781457717703, 9781457717697

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Application of response surface methods in Lead-free solder joints of plastic ball grid array thermal fatigue life prediction

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066961 ◽

2011 ◽

Cited By ~ 1

Author(s):

Zhao Qiang ◽

Dejian Zhou

Keyword(s):

Life Prediction ◽

Ball Grid Array ◽

Fatigue Life Prediction ◽

Lead Free ◽

Lead Free Solder ◽

Response Surface Methods ◽

Thermal Fatigue Life ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Free Solder

Freeform lens design for uniform illumination with extended source

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6067016 ◽

2011 ◽

Cited By ~ 1

Author(s):

Dan Wu ◽

Kai Wang ◽

Sheng Liu

Keyword(s):

Lens Design ◽

Uniform Illumination ◽

Extended Source ◽

Freeform Lens

Mechanical properties and electrochemical corrosion behavior of Al-Cu solder joint with Sn-Zn based solder

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066846 ◽

2011 ◽

Cited By ~ 1

Author(s):

Ning Kang ◽

Mingliang Huang ◽

Qiang Zhou ◽

Haitao Ma

Keyword(s):

Mechanical Properties ◽

Solder Joint ◽

Corrosion Behavior ◽

Electrochemical Corrosion ◽

Electrochemical Corrosion Behavior

Void mechanism research and control in solder joint

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066934 ◽

2011 ◽

Cited By ~ 2

Author(s):

Xie Xiaoqiang ◽

Zhou Jianwei ◽

Chae Jonghyun ◽

Chung Myungkee

Keyword(s):

Solder Joint ◽

Mechanism Research ◽

And Control

Thermal stress analysis of PBGA under natural convection using a fluid-solid coupling method

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066904 ◽

2011 ◽

Cited By ~ 2

Author(s):

Zhimin Wan ◽

Xiaobing Luo ◽

Sheng Liu

Keyword(s):

Thermal Stress ◽

Natural Convection ◽

Stress Analysis ◽

Coupling Method ◽

Thermal Stress Analysis

Study on intelligent identification technology of solder joints defects based on LMBP neural network

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066924 ◽

2011 ◽

Cited By ~ 2

Author(s):

Zhaohua Wu

Keyword(s):

Neural Network ◽

Solder Joints

Effect of quantum effects on electrical transport in Si/Ge/Si sandwich structure

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066829 ◽

2011 ◽

Author(s):

Leilei Han ◽

Chunqing Wang

Keyword(s):

Electrical Transport ◽

Sandwich Structure ◽

Quantum Effects

Simulations for a novel fluid dispensing technology based on gas-liquid slug flow

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066942 ◽

2011 ◽

Author(s):

Peng Peng ◽

Jianhua Zhang ◽

Jinsong Zhang

Keyword(s):

Slug Flow ◽

Liquid Slug ◽

Fluid Dispensing

Fabrication and in-situ evaluation of copper TSV interconnection

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066801 ◽

2011 ◽

Cited By ~ 2

Author(s):

Shenglin Ma ◽

Yunhui Zhu ◽

Xin Sun ◽

Min Miao ◽

Jin Chen ◽

...

Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066831 ◽

2011 ◽

Author(s):

Jianfeng Yan ◽

Guisheng Zou ◽

Xiaoyu Wang ◽

Hailin Bai ◽

Fengwen Mu ◽

...

Keyword(s):

Low Temperature ◽

Ag Nanoparticles ◽

Large Scale ◽

Polyol Process ◽

Large Scale Synthesis ◽

Low Temperature Bonding

2011 12th International Conference on Electronic Packaging Technology and High Density PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Application of response surface methods in Lead-free solder joints of plastic ball grid array thermal fatigue life prediction

Freeform lens design for uniform illumination with extended source

Mechanical properties and electrochemical corrosion behavior of Al-Cu solder joint with Sn-Zn based solder

Void mechanism research and control in solder joint

Thermal stress analysis of PBGA under natural convection using a fluid-solid coupling method

Study on intelligent identification technology of solder joints defects based on LMBP neural network

Effect of quantum effects on electrical transport in Si/Ge/Si sandwich structure

Simulations for a novel fluid dispensing technology based on gas-liquid slug flow

Fabrication and in-situ evaluation of copper TSV interconnection

Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging
Latest Publications