A Miniaturized Broadband Receiving Front-end Module Based on Sip Package

Contents Structural components/Strukturbauteile Development of an energy-absorbing structural element made of polyamide integrated in the plastic front-end carrier of the new Mercedes S-Class ..... 1 Entwicklung eines energieabsorbierenden Strukturelements aus Polyamid integriert im Kunststoff-Frontendträger der neuen Mercedes S-Klasse ..... 5 BAGS: Highly-integrated front-end module carrier ..... 9 BAGS: Hochintegrierter Front End Modulträger ..... 19 Surfaces/Oberflächen Lightweight plastic construction with visible surface as examplified by the Volkswagen ID 3 tailgate ..... 29 Kunststoffleichtbau mit Sichtoberfläche am Beispiel der Heckklappe Volkswagen ID3 ..... 39 Breakthrough in producing soft and sustainable interior surfaces by injection moulding of TPE ..... 49 Simulation The all-new MAN high-roof cab – epoxy sandwich RTM – simulated using FEM and crashed under real conditions ..... 61 Epoxid-Sandwich-RTM – FEM gerechnet und real gecrasht ..... 75 Development and validation of a simulation methodology for the prediction of surface defects for plastic components with metallic effect pig...

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A 140 GHz T/R Front-End Module in 22 nm FD-SOI CMOS

2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) ◽

10.1109/rfic51843.2021.9490470 ◽

2021 ◽

Author(s):

Xinyan Tang ◽

Johan Nguyen ◽

Giovanni Mangraviti ◽

Zhiwei Zong ◽

Piet Wambacq

Keyword(s):

Front End ◽

Front End Module ◽

Soi Cmos

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An Integrated K-Band Receiving Front-End Module for Satellite Communication

10.1109/icmmt52847.2021.9617852 ◽

2021 ◽

Author(s):

Zhong-Lin Xu ◽

Zheng Dong ◽

Hong-Tao Liao ◽

Liang-Feng Qiu ◽

Sheng-Tuan She ◽

...

Keyword(s):

Satellite Communication ◽

Front End ◽

Front End Module ◽

K Band

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An LTCC Based Filter and Front End Module using Heterogeneous Dielectrics

Journal of Microelectronics and Electronic Packaging ◽

10.4071/1551-4897-3.3.129 ◽

2006 ◽

Vol 3 (3) ◽

pp. 129-135 ◽

Cited By ~ 1

Author(s):

Jun Chul Kim ◽

Dongsu Kim ◽

Hyun Min Cho ◽

Jong Chul Park ◽

Nam Kee Kang

Keyword(s):

Power Amplifier ◽

Bandpass Filter ◽

Wave Length ◽

Signal Delay ◽

Ceramic Substrates ◽

Front End ◽

Quarter Wave ◽

Front End Module ◽

Signal Delay Time ◽

Shunt Capacitor

This paper presents a multi-layered bandpass filter (BPF) and a power amplifier module (PAM) integrated with a SAW duplexer based on heterogeneous ceramic substrates. The heterogeneous substrates are composed of two different ceramic layers with εr = 7.4 and 17.5 in order to take advantage of their own properties. In the PAM substrate, a DC blocking capacitor and a shunt capacitor for an output matching network of a power amplifier are embedded with a material of εr = 17.5 to reduce occupied areas of the capacitors. On the other hand, a quarter-wave-length stripline and RF chokes are realized with a material of εr = 7.4 to reduce signal delay time. In the multi-layered BPF, a coupled stripline and a high shunt capacitor are embedded with materials of εr = 7.4 and 17.5, respectively, resulting in improved spurious characteristics.

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