front end module
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2021 ◽  
Author(s):  
Xuexue Zhang ◽  
Kun Qiao ◽  
Qin Chen ◽  
Yue Liang ◽  
Lianming Li ◽  
...  
Keyword(s):  

Electronics ◽  
2021 ◽  
Vol 10 (16) ◽  
pp. 1893
Author(s):  
Faxin Yu ◽  
Qi Zhou ◽  
Zhiyu Wang ◽  
Jiongjiong Mo ◽  
Hua Chen

In this paper, a three-dimensional heterogenous-integrated (3DHI) wafer-level packaging (WLP) process is proposed, and a radio frequency (RF) front-end module with two independent ultra-high frequency (UHF) receiving channels are designed and implemented, which covers 400 MHz–600 MHz and 2050 MHz–2200 MHz respectively for unmanned aerial vehicle (UAV) applications. The module is formed by wafer-to-wafer (W2W) bonding of two high-resistivity silicon (HR-Si) interposers with embedded bare dies and through silicon via (TSV) interconnections. Double-sided deep reactive ion etching (DRIE) and conformal electroplating process are introduced to realize the high-aspect-ratio TSV connection within 290 µm-thick cap interposer. Co-plane waveguide (CPW) transmission lines are fabricated as the process control monitor (PCM), the measured insertion loss of which is less than 0.18 dB/mm at 35 GHz. The designed RF front-end module is fabricated and measured. The measured return loss and gain of each RF channel is better than 13 dB and 21 dB, and the noise figure is less than 1.5 dB. In order to evaluate the capability of the 3DHI process for multi-layer interposers, the module is re-designed and fabricated with four stacked high-resistivity silicon interposers. After W2W bonding of two pairs of interposers and wafer slicing, chip-to chip (C2C) bonding is applied to form a four-layer module with operable temperature gradient.


Algorithms ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 218
Author(s):  
João V. Roque ◽  
João D. Lopes ◽  
Mário P. Véstias ◽  
José T. de Sousa

Open-source processors are increasingly being adopted by the industry, which requires all sorts of open-source implementations of peripherals and other system-on-chip modules. Despite the recent advent of open-source hardware, the available open-source caches have low configurability, limited lack of support for single-cycle pipelined memory accesses, and use non-standard hardware interfaces. In this paper, the IObundle cache (IOb-Cache), a high-performance configurable open-source cache is proposed, developed and deployed. The cache has front-end and back-end modules for fast integration with processors and memory controllers. The front-end module supports the native interface, and the back-end module supports the native interface and the standard Advanced eXtensible Interface (AXI). The cache is highly configurable in structure and access policies. The back-end can be configured to read bursts of multiple words per transfer to take advantage of the available memory bandwidth. To the best of our knowledge, IOb-Cache is currently the only configurable cache that supports pipelined Central Processing Unit (CPU) interfaces and AXI memory bus interface. Additionally, it has a write-through buffer and an independent controller for fast, most of the time 1-cycle writing together with 1-cycle reading, while previous works only support 1-cycle reading. This allows the best clocks-per-Instruction (CPI) to be close to one (1.055). IOb-Cache is integrated into IOb System-on-Chip (IOb-SoC) Github repository, which has 29 stars and is already being used in 50 projects (forks).


Author(s):  
Xinyan Tang ◽  
Johan Nguyen ◽  
Giovanni Mangraviti ◽  
Zhiwei Zong ◽  
Piet Wambacq
Keyword(s):  

2021 ◽  
Vol 25 (5) ◽  
pp. 61-70
Author(s):  
Tiwat Pongthavornkamol ◽  
Aman Worasutr ◽  
Denchai Worasawate ◽  
La-or Kovaisaruch ◽  
Kamol Kaemarungsi

2021 ◽  
Author(s):  
Zhong-Lin Xu ◽  
Zheng Dong ◽  
Hong-Tao Liao ◽  
Liang-Feng Qiu ◽  
Sheng-Tuan She ◽  
...  

2021 ◽  
Author(s):  
Zhong-Lin Xu ◽  
Zheng Dong ◽  
Hong-Tao Liao ◽  
Liang-Feng Qiu ◽  
Sheng-Tuan She ◽  
...  

2021 ◽  
Author(s):  
Weijie Lin ◽  
Haidong Chen ◽  
Kun Tang ◽  
Wenquan Che ◽  
Quan Xue

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