An in-situ measurement method for thermally induced packaging stress in distributed RF MEMS Phase Shifters
2013 ◽
Vol 78
(685)
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pp. 269-275
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1991 ◽
Vol 115
(1-4)
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pp. 348-352
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2015 ◽
Vol 21
(47)
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pp. 167-170
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2011 ◽
Vol 76
(661)
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pp. 289-295
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2013 ◽
Vol 49
(11)
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pp. 3548-3560
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