Molecular engineering for future device structures: self-assembled monolayers as diffusion barriers for Cu metallization
1996 ◽
Vol 118
(51)
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pp. 13051-13057
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2006 ◽
Vol 153
(3)
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pp. C142
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Keyword(s):
2019 ◽
Vol 1
(3)
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pp. 430-436
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2008 ◽
Vol 85
(10)
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pp. 2047-2050
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Keyword(s):
2006 ◽
Vol 9
(7)
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pp. F61
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2010 ◽
Vol 20
(7)
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pp. 1125-1131
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Keyword(s):
Keyword(s):
2003 ◽
Vol 104
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pp. 459-462
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