Bottom-Up Engineering of Subnanometer Copper Diffusion Barriers Using NH2-Derived Self-Assembled Monolayers

Bottom Up ◽

Copper Diffusion ◽

Assembled Monolayers ◽

Patterned Self-Assembled Monolayers for Bottom-Up Fabrication of Nanoarchitectures

General Chemistry ◽

10.21127/yaoyigc20190023 ◽

2019 ◽

Vol 5 (3) ◽

pp. 190023-190023

Author(s):

Chen Fang ◽

Chen Fang

Keyword(s):

Bottom Up ◽

Assembled Monolayers ◽

Enhanced CVD of Copper Films on Self-Assembled Monolayers as Ultrathin Diffusion Barriers

Journal of The Electrochemical Society ◽

10.1149/1.2158577 ◽

2006 ◽

Vol 153 (3) ◽

pp. C142 ◽

Cited By ~ 19

Author(s):

Xin Liu ◽

Qi Wang ◽

Song Wu ◽

Zengzeng Liu

Keyword(s):

Diffusion Barriers ◽

Copper Films ◽

Assembled Monolayers ◽

Surface-Functionalized Interfacial Self-Assembled Monolayers as Copper Electrode Diffusion Barriers for Oxide Semiconductor Thin-Film Transistor

ACS Applied Electronic Materials ◽

10.1021/acsaelm.8b00132 ◽

2019 ◽

Vol 1 (3) ◽

pp. 430-436 ◽

Cited By ~ 5

Author(s):

Sung-Eun Lee ◽

Jintaek Park ◽

Junhee Lee ◽

Eun Goo Lee ◽

Changik Im ◽

...

Keyword(s):

Thin Film ◽

Thin Film Transistor ◽

Copper Electrode ◽

Diffusion Barriers ◽

Oxide Semiconductor ◽

Assembled Monolayers ◽

Semiconductor Thin Film ◽

Screening self-assembled monolayers as Cu diffusion barriers

Microelectronic Engineering ◽

10.1016/j.mee.2008.04.014 ◽

2008 ◽

Vol 85 (10) ◽

pp. 2047-2050 ◽

Cited By ~ 25

Author(s):

A. Maestre Caro ◽

G. Maes ◽

G. Borghs ◽

C.M. Whelan

Keyword(s):

Diffusion Barriers ◽

Assembled Monolayers ◽

Molecular engineering for future device structures: self-assembled monolayers as diffusion barriers for Cu metallization

2007 Digest of papers Microprocesses and Nanotechnology ◽

10.1109/imnc.2007.4456304 ◽

2007 ◽

Author(s):

C.M. Whelan ◽

A. Maestre Caro ◽

F. Clemente ◽

G. Beyer ◽

Z. Tokei ◽

...

Keyword(s):

Diffusion Barriers ◽

Molecular Engineering ◽

Cu Metallization ◽

Device Structures ◽

Assembled Monolayers ◽

Localization of octadecyltrimethoxysilane self-assembled monolayers by a combination of bottom-up and top-down approaches

Silanes and Other Coupling Agents, Volume 4 ◽

10.1201/b12202-15 ◽

2007 ◽

pp. 163-172

Keyword(s):

Top Down ◽

Bottom Up ◽

Assembled Monolayers ◽

Self-assembled monolayers of terminal acetylenes as replacements for thiols in bottom-up tunneling junctions

RSC Advances ◽

10.1039/c4ra09880c ◽

2014 ◽

Vol 4 (99) ◽

pp. 56026-56030 ◽

Cited By ~ 13

Author(s):

Davide Fracasso ◽

Sumit Kumar ◽

Petra Rudolf ◽

Ryan C. Chiechi

Keyword(s):

Molecular Electronics ◽

Bottom Up ◽

Assembled Monolayers ◽

Tunneling Junctions ◽

Self Assembled ◽

Terminal Acetylenes

Why use thiols in Molecular Electronics?

Metallated Porphyrin Self Assembled Monolayers as Cu Diffusion Barriers for the Nano-Scale CMOS Technologies

2008 8th IEEE Conference on Nanotechnology ◽

10.1109/nano.2008.56 ◽

2008 ◽

Cited By ~ 8

Author(s):

Mrunal A. Khaderbad ◽

Kaushik Nayak ◽

M. Yedukondalu ◽

M. Ravikanth ◽

S. Mukherji ◽

...

Keyword(s):

Diffusion Barriers ◽

Nano Scale ◽

Assembled Monolayers ◽

On the use of (3-trimethoxysilylpropyl)diethylenetriamine self-assembled monolayers as seed layers for the growth of Mn based copper diffusion barrier layers

Applied Surface Science ◽

10.1016/j.apsusc.2017.08.020 ◽

2018 ◽

Vol 427 ◽

pp. 260-266 ◽

Cited By ~ 15

Author(s):

A. Brady-Boyd ◽

R. O’Connor ◽

S. Armini ◽

V. Selvaraju ◽

G. Hughes ◽

...

Keyword(s):

Diffusion Barrier ◽

Copper Diffusion ◽

Barrier Layers ◽

Assembled Monolayers ◽

Self Assembled ◽

Seed Layers

Self-Assembled Monolayers as Cu Diffusion Barriers for Ultralow-k Dielectrics

Electrochemical and Solid-State Letters ◽

10.1149/1.2201988 ◽

2006 ◽

Vol 9 (7) ◽

pp. F61 ◽

Cited By ~ 13

Author(s):

B. Ramana Murthy ◽

Wan Mun Yee ◽

Ahila Krishnamoorthy ◽

R. Kumar ◽

D. C. Frye

Keyword(s):

Diffusion Barriers ◽

Assembled Monolayers ◽