scholarly journals Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology

Author(s):  
A. C. Fischer ◽  
H. Gradin ◽  
S. Braun ◽  
S. Schroder ◽  
G. Stemme ◽  
...  
2012 ◽  
Vol 23 (1) ◽  
pp. 015008 ◽  
Author(s):  
Henrik Gradin ◽  
Sobia Bushra ◽  
Stefan Braun ◽  
Göran Stemme ◽  
Wouter van der Wijngaart

2017 ◽  
Vol 700 ◽  
pp. 132-139 ◽  
Author(s):  
Chuanliang Shen ◽  
Zhipeng Wu ◽  
Zhenhai Gao ◽  
Xiaoyu Ma ◽  
Shengtong Qiu ◽  
...  

Materialia ◽  
2021 ◽  
pp. 101090
Author(s):  
A. Shamsolhodaei ◽  
J.P. Oliveira ◽  
B. Panton ◽  
B. Ballesteros ◽  
N. Schell ◽  
...  

2021 ◽  
Vol 42 (10) ◽  
Author(s):  
José Ricardo Ferreira-Oliveira ◽  
Paulo César Sales da Silva ◽  
Luiz Roberto Rocha de Lucena ◽  
Rômulo Pierre Batista dos Reis ◽  
Carlos José de Araújo ◽  
...  

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